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4 Layer FR4 PCB Production Record #FR4-20251219-009

FR4 PCB 4 Layers ENIG (Immersion Gold) Impedance Control 4/4mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 78 x 123 mm Copper Weight 1oz
Thickness 0.8 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Dec 11 13:58
Files Ready
Dec 11 13:58
Engineering Review Completed
Dec 11 15:29
Payment down
Dec 11 15:02
Production Started
Dec 11 15:30
Production Completed
Dec 17 02:09
Progress: 0/6
Engineering Review time: 1.5 h
Production time: 5.5d With Engineering Questions

Logistics Information

Production Completed→Shipping : 2.6d
Carrier
UPS
Destination
KOREA, REPUBLIC OF (SOUTH K.)
Shipping Method
Express Air
Shipping Time
Dec 19 14:20

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This production record covers five 4-layer FR4 panel PCBs measuring 78 × 123 mm with a finished thickness of 0.8 mm and 1 oz copper throughout. The design specified 4/4 mil minimum track and spacing, 0.2 mm minimum hole size, green soldermask, white silkscreen, and immersion gold ENIG finish on a default stackup. These parameters combine a thin profile with tighter geometry, requiring exact process control during multilayer fabrication while maintaining standard FR4 material properties.

We performed inner layer imaging and circuit etching to resolve the 4 mil features, followed by precise layer stack alignment and high pressure lamination calibrated for the 0.8 mm thickness to preserve registration and flatness. Solder mask application was succeeded by electroless nickel deposition and immersion gold deposition, producing a uniform ENIG surface suitable for assembly. The entire sequence from material preparation through final electrical testing was executed without deviation from the defined parameters.

All five panels passed continuity and isolation testing, confirming consistent electrical performance across the batch. The order was completed in 5.5 days, delivering reliable boards that matched the customer’s specifications for this small-quantity, fine-feature run.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-095 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail

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