| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 600 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 57 x 57 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Matte Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
The manufacturing of these 600 units of 4-layer FR4 PCBs involved processing panels sized at 57 x 57 mm with 1.6 mm thickness and 1 oz copper layers. The 5/5 mil track and spacing specification classified this as a tighter geometry run, necessitating accurate registration during inner layer imaging and etching. ENIG surface finish was applied to complement the matte green soldermask and white silkscreen, ensuring good contrast and protection for the 0.3 mm minimum holes.
Execution began with material preparation and continued through high pressure lamination for stable multilayer construction. Solder mask application and the subsequent electroless nickel and immersion gold deposition steps were monitored closely to maintain uniform coverage across the panel surfaces. Batch AOI inspection integrated at multiple points helped identify and address any anomalies promptly.
All 600 panels passed electrical testing, confirming the reliability of the build. Produced over 4.5 days, this order demonstrated efficient handling of the specified parameters, delivering consistent quality suitable for standard electronic assemblies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260520-046 | FR4 PCB | 2 | 94.21 x 275 | Green | ENIG (Immersion Gold) | 75 | View detail |
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260512-016 | FR4 PCB | 4 | 63.5 x 127 | Green | ENIG (Immersion Gold) | 10 | View detail |