PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 15 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 285.24 x 175.25 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order consisted of 15 four-layer FR4 Panel PCBs measuring 285.24 x 175.25 mm with a custom 1.6 mm stackup and 1 oz copper weight. We performed inner layer imaging and etching on the standard 6/6 mil design before proceeding to layer alignment and high-pressure lamination. The 0.2 mm minimum hole size fit within conventional drilling parameters for these large panels.
Green solder mask and white silkscreen were applied after lamination, followed by electroless nickel deposition and immersion gold to create the ENIG surface finish. This provided flat, oxidation-resistant pads suitable for assembly. Electrical testing verified continuity and isolation on every panel.
The full manufacturing sequence from engineering review through material preparation, circuit etching, solder mask, ENIG processing and final test was completed in 4.2 days, producing panels that met all specified requirements for this non-impedance-controlled 4-layer FR4 PCB build.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |
