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4 Layer FR4 PCB Production Record #FR4-20260103-011

FR4 PCB 4 Layers ENIG (Immersion Gold) Impedance Control 0.2mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 110 x 90 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Matte Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Dec 10 12:42
Files Ready
Dec 10 12:43
Engineering Review Completed
Dec 10 14:36
Payment down
Dec 18 23:33
Production Started
Dec 19 09:35
Production Completed
Dec 30 14:49
Progress: 0/6
Engineering Review time: 1h
Production time: 11.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 3.6d
Carrier
DHL
Destination
BELGIUM
Shipping Method
Express Air
Shipping Time
Jan 03 04:56

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This order required fabrication of 10 panels for a standard 4-layer FR4 PCB. Each panel measured 110 x 90 mm with a finished thickness of 1.6 mm and 1 oz copper weight on all layers. The minimum feature size stayed at 6/6 mil for track and spacing, paired with 0.2 mm holes, while the surface combined matte green soldermask, white silkscreen, and immersion gold ENIG. These choices suited typical assembly needs without calling for advanced controls such as impedance matching.

Production began with engineering review and material preparation before moving into inner layer imaging, circuit etching, and accurate stack alignment. High pressure lamination bonded the layers reliably, after which we applied the soldermask and performed electroless nickel deposition followed by immersion gold. Electrical testing validated connectivity across all panels.

Completed over 11.3 days, the run delivered panels fully aligned with the provided specifications. Consistent processing at each stage supported dependable quality suitable for standard electronic applications.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-095 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail

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