Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:

4 Layer FR4 PCB Production Record #FR4-20260104-016

FR4 PCB 4 Layers ENIG (Immersion Gold) Impedance Control Small Volume
Start FR4 PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 150 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 129 x 175 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Dec 15 18:18
Files Ready
Dec 15 18:18
Engineering Review Completed
Dec 15 18:26
Payment down
Dec 15 18:40
Production Started
Dec 15 18:43
Production Completed
Dec 19 21:20
Progress: 0/6
Engineering Review time: 2 min
Production time: 4.2d

Logistics Information

Production Completed→Shipping : 16.0d
Carrier
FedEx IP
Destination
ITALY
Shipping Method
Express Air
Shipping Time
Jan 04 19:16

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This production record covers a standard 4-layer FR4 PCB fabricated with immersion gold ENIG surface finish. The boards measured 1.6 mm in thickness with 1 oz copper weight on all layers and maintained a conventional minimum track and spacing of 6 mil. These parameters allowed for straightforward yet precise processing through our established workflow, beginning with engineering review and material preparation to verify all incoming materials.

Inner layer imaging established the internal circuitry, followed by circuit imaging and etching for the outer layers. Layer stack alignment received close attention prior to high pressure lamination, ensuring excellent interlayer registration. Solder mask application prepared the surfaces for electroless nickel deposition and immersion gold deposition, delivering a flat pad finish known for its excellent solderability and long shelf life.

Final electrical testing verified continuity and insulation resistance across the full batch. The complete cycle took 4.2 days from start to finish, resulting in panels that exhibited uniform quality and reliable performance characteristics.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260512-016 FR4 PCB 4 63.5 x 127 Green ENIG (Immersion Gold) 10 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy