| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 317.5 x 127 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.25mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
This order consisted of 120 pieces of standard 4-layer FR4 PCB produced on 40 panels. Boards measured 95 × 75 mm with 1.6 mm finished thickness, 1 oz copper on all layers, and 6/6 mil minimum track and spacing. Immersion gold ENIG surface finish was applied to ensure stable solderability and long-term protection for the intended electronics assembly.
Execution began with engineering review and material preparation, followed by inner layer imaging, circuit etching, and precise layer stack alignment before high pressure lamination. Solder mask was registered and cured, after which electroless nickel deposition and immersion gold deposition created the final surface. Every board completed 100 % electrical testing to confirm net continuity and isolation.
The full production run finished in 6.5 days with all panels meeting dimensional, plating, and electrical requirements. Registration remained within tolerance across the multilayer stack, delivering repeatable quality suited to the customer’s delivery schedule.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |