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ENIG FR4 PCB Production Record #FR4-20260515-068

FR4 PCB 14 Layers ENIG (Immersion Gold) Impedance Control 4/4mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 14 Layers Board Type Panel PCB
Dimensions 244 x 267 mm Copper Weight 1oz
Thickness 2 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Apr 20 19:01
Files Ready
Apr 20 19:07
Engineering Review Completed
Apr 20 19:59
Payment down
Apr 22 18:05
Production Started
Apr 22 18:07
Production Completed
May 15 15:25
Progress: 0/6
Engineering Review time: 0.9 h
Production time: 22.9d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.7 h
Carrier
DHL
Destination
INDIA
Shipping Method
Express Air
Shipping Time
May 15 16:05

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

This 14-layer TG170 board measured 244 × 267 mm at 2.0 mm thickness with 2 oz inner and 1 oz outer copper. Minimum trace and space of 4 mil, combined with impedance control, ENIG finish at 1 µm gold, and resin plugging on selected vias, required multiple engineering file revisions before release. The 10-piece run followed an 18-day factory schedule after panelization in 1×1 format with 5 mm process edges and mechanical routing.

 

DFM review identified solder-mask openings as small as 3.94 mil, non-metallized hole tolerances too tight for stable control, and uncertainty over which vias required resin plugging versus solder-mask tenting. Additional issues included impedance lines absent from source data, copper features too close to the board edge on layer 3, and non-plated holes drilled through SMD pads. Secondary drilling was applied to preserve pad integrity on those locations, impedance trace widths were adjusted to the verified stack-up, and plugging requirements were clarified on the final production drawings. Copper bridges on the bottom layer were retained only where specified, and edge copper was trimmed to prevent exposure after routing.

 

All revisions were incorporated into the released files, 100 % flying-probe testing was performed, and the boards shipped complete with electrical test reports and certificates. The process confirmed that the 14-layer TG170 DFM handling maintained required impedance values and via fill integrity across the small lot.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-095 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail

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