Typical Specification Range
| Parameter | Typical Range |
|---|---|
| Layer count | 1-32 layers |
| Material type | FR4, high Tg FR4 |
| Surface finish | ENIG |
| Thickness | 0.4-3.2 mm |
| Solder mask | Green, black, red, white, yellow, blue, purple, matte black, matte black |
| Copper thickness | 1-8 oz |
| Special features | RoHS compliant, Nickel: 3-6 µm |
Manufacturing Process Insights
Inner Layer & Lamination Cores are imaged, etched and laminated with controlled copper balance. Proper registration and dielectric uniformity are essential so that subsequent ENIG plating achieves consistent nickel-gold coverage across all pads and vias.
Precision Drilling & Desmear Through-holes (and any controlled-depth features) are drilled and chemically cleaned. Clean hole walls and complete smear removal are critical—any residue interferes with electroless nickel deposition and can cause plating voids under ENIG.
Electroless Nickel Immersion Gold (ENIG) A uniform nickel barrier (typically 3–6 µm) is deposited followed by a thin immersion gold layer (0.05–0.15 µm). Process chemistry, bath control and dwell time are tightly monitored to prevent black-pad defects, ensure flatness for fine-pitch/BGA assembly, and deliver long shelf life.
Solder Mask Application Liquid photoimageable mask is applied and developed with high registration accuracy. Full, clean openings on all ENIG pads and gold-finger areas are mandatory—residual mask or oversized windows directly degrade solderability and corrosion resistance.
Via Plugging / Tenting Resin plugging or tenting is performed before or after ENIG according to design intent. Incomplete fill or conflicting mask openings can cause resin overflow, planarity issues or contamination that compromise the ENIG surface.
Final Inspection & Thickness Verification Gold and nickel thickness are measured, visual inspection checks for black-pad indicators or exposed copper, and electrical testing confirms continuity. Only boards meeting ENIG thickness and surface-quality criteria are released.
Manufacturing Order Profile
| Order Quantity | Order Proportion | Estimated Price Level | Typical Lead Time |
|---|---|---|---|
| Prototype (<=30 pcs) | 40% | From $8 | From 2 days |
| Small volume (30-200 pcs) | 45% | From $40 | From 2 days |
| Mass production (>200 pcs) | 15% | From $70 | From 2 days |
Manufacturing Challenges & Process Optimization
Design Considerations
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| Loading... | |||||||
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