Discover how AIVON manufactures High Tg FR4 PCBs, including high-temperature material selection, thermal reliability requirements, fabrication processes, manufacturing challenges, and real production experience from customer orders.
| Parameter | Typical Range |
|---|---|
| Layer count | 4-32 layers |
| Material type | High Tg FR4 |
| Surface finish | ENIG, Lead-free HASL, Immersion Silver |
| Thickness | 0.6-3.2 mm |
| Solder mask | Green, black, red, white |
| Copper thickness | 1oz-6oz |
| Special features | Controlled impedance, thermal management vias, low CTE |
Material Selection & Incoming Verification High Tg FR4 (typically Tg ≥ 170°C) is selected for superior thermal stability and lower Z-axis expansion. Material lot and actual Tg value are verified before production to ensure the resin system can withstand lead-free reflow and repeated thermal cycling.
Inner Layer Imaging & Lamination Cores are imaged and etched, then laminated with high-Tg prepregs under elevated temperature and pressure. Copper balance and dielectric symmetry are strictly controlled because High Tg resin flow behavior differs from standard FR4 and directly affects final thickness and warpage.
Precision Drilling CNC drilling parameters are adjusted for the harder High Tg resin system. Optimized speeds, feeds and entry/backup materials reduce hole-wall roughness and tool wear while maintaining registration accuracy across layers.
Desmear & Plating Chemical desmear is tuned for High Tg resin smear removal. Electroless and electrolytic copper deposition ensure reliable via plating that can survive the higher thermal stress expected of High Tg boards.
Outer Layer Patterning & Etching Outer layers are imaged and etched with compensation for the selected copper weight. On 2 oz High Tg constructions, etch factor control is critical to prevent excessive undercut on fine lines.
Solder Mask & Surface Finish Solder mask is applied with tight registration. Surface finishes such as ENIG are processed under conditions that preserve the thermal integrity of the High Tg laminate.
Routing / V-Scoring & Final Inspection Mechanical forming accounts for the higher rigidity of High Tg material. Final inspection includes thickness, warpage and thermal-reliability related checks before shipment.
| Order Quantity | Order Proportion | Estimated Price Level | Typical Lead Time |
|---|---|---|---|
| Prototype (<=30 pcs) | 55% | From $30 | From 2 days |
| Small volume (30-200 pcs) | 22% | From $50 | From 2 days |
| Mass production (>200 pcs) | 23% | From $95 | From 2 days |
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
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