2 layer rigid-flex PCBs combine a double-sided flexible polyimide circuit with selective rigid sections in a single board. Uses polyimide flex core with FR-4 or polyimide stiffeners. Supports coverlay on flexible areas and solder mask on rigid zones.
| Parameter | Typical Range |
|---|---|
| Layer count | 2 layers |
| Material type | Polyimide flex with selective FR4 rigid laminations |
| Surface finish | ENIG, OSP, Immersion Silver |
| Thickness | Rigid board thickness 0.3mm - 1.6mm, FPC Thickness 0.08mm - 0.2mm |
| Solder mask | Flexible solder mask and polyimide coverlay |
| Copper thickness | 0.5oz to 2oz |
| Special features | Selective bonding, stiffeners, controlled bend areas, ZIF fingers |
Lamination: FR4 rigid material is selectively bonded to polyimide flex core using no-flow prepreg. Precise registration and controlled pressure prevent wrinkles at transition zones.
Drilling and Plating: Mechanical drilling creates vias. Chemical copper deposition followed by electrolytic plating establishes interlayer connections. Plasma treatment improves hole wall adhesion.
Surface Finish and Coverlay: ENIG is applied for solderability. Polyimide coverlay protects flex circuits. Strict process sequencing minimizes thermal stress on flex material.
Risk Control: Cross-section inspection verifies bonding quality. CTE mismatch is managed through material selection and lamination profiles.
| Order Quantity | Order Proportion | Estimated Price Level | Typical Lead Time |
|---|---|---|---|
| Prototype (<=30 pcs) | 66% | From $215 | From 13 days |
| Small volume (30-200 pcs) | 19% | From $315 | From 15 days |
| Mass production (>200 pcs) | 15% | From $649 | From 16 days |
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
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