PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 177 x 209 mm | Copper Weight | 2oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order consisted of 4-layer FR4 PCBs measuring 110 × 85 mm, built at 2.0 mm thickness with 2 oz copper on all layers. The design carried a 6/6 mil minimum track and spacing together with 0.25 mm vias, requiring exact registration during inner layer imaging and controlled copper etching. Immersion gold ENIG surface finish was applied to ensure stable contact resistance and long-term solderability.
After engineering review and material preparation, the stack underwent precise layer alignment and high-pressure lamination. Thick copper electroplating built reliable barrel walls, followed by solder mask application, electroless nickel deposition, and immersion gold deposition. Full electrical testing verified netlist integrity across every panel before release.
The complete run finished in 4.2 days with stable plating uniformity and copper distribution. Resulting boards met all dimensional and electrical criteria, providing consistent performance for the intended power-control application.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |
