| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 300 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 119 x 235 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | None |
| Stack-up | Custom | Impedance Control | No |
This order consisted of a standard 4-layer FR4 PCB produced with an immersion gold ENIG finish. Material preparation and engineering review preceded the inner layer imaging and precise circuit etching phases, where 6 mil trace width and spacing were maintained using 1 oz copper foil. Following layer stack alignment, high pressure lamination created a robust 1.6 mm thick board with excellent interlayer connections.
Application of solder mask preceded the electroless nickel deposition and immersion gold deposition to form a flat, reliable surface for component assembly. In-process checks including batch AOI inspection supported consistent results across the panels. Comprehensive electrical testing validated circuit continuity and isolation on all units prior to shipment.
Completed over an 8-day production window, the lot demonstrated stable process control from start to finish. The executed steps resulted in boards that meet typical assembly needs while providing good corrosion resistance thanks to the ENIG coating.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-094 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260427-053 | FR4 PCB | 4 | 96.1 x 187 | Green | ENIG (Immersion Gold) | 125 | View detail |