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8 Layer FR4 PCB Production Record #FR4-20260115-006

FR4 PCB 8 Layers ENIG (Immersion Gold) Impedance Control 0.1mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 77.5 x 60 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.1mm
Solder Mask Green Silkscreen None
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Dec 09 15:08
Files Ready
Dec 09 15:08
Engineering Review Completed
Dec 18 18:48
Payment down
Dec 09 15:08
Production Started
Dec 20 11:13
Production Completed
Dec 30 19:07
Progress: 0/6
Engineering Review time: 9.2d Multiple File Revisions
Production time: 10.4d With Engineering Questions

Logistics Information

Production Completed→Shipping : 15.7d
Carrier
DHL
Destination
DENMARK
Shipping Method
Express Air
Shipping Time
Jan 15 10:30

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 8-layer FR-4 board (77.5 × 60 mm, 1.6 mm finished thickness) was built as 10 pieces using Shengyi S1000-2M TG170 material with 0.5 oz copper on inner layers and 1 oz on outer layers. The design featured 0.1 mm minimum holes, 5 mil line width/space, ENIG surface finish, blind and buried vias, and aluminum-plugged vias. Production used AIVON panelization with 4 mm process edges on left and right sides, completed in 9 days with 100% flying probe testing and full electrical test reports plus quality certificates.

 

DFM review resolved several layer and plating conflicts. Copper weight specifications were clarified and aligned between the order requirements and stack-up, with adjustments made to ensure proper plating on buried vias (L2-L7). Solder mask openings versus tenting were verified for critical vias and etched frames. Legend (silk screen) requirements were confirmed as none, with UL marking and other identifiers added on the bottom side per reference. Stack-up was optimized and confirmed to meet the target 1.6 mm finished thickness while supporting reliable via formation and aluminum plugging.

 

All production files and parameters were confirmed before release. The completed boards met dimensional, electrical, and via reliability requirements with consistent plating and surface finish. For detailed handling of the copper weight conflict and buried via plating in this TG170 build, refer to the related engineering case.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-094 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail

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