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8 Layer FR4 PCB Production Record #FR4-20260115-007

FR4 PCB 8 Layers ENIG (Immersion Gold) Impedance Control 0.1mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 77.5 x 60 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 5/5mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.1mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Dec 02 17:15
Files Ready
Dec 02 17:15
Engineering Review Completed
Dec 18 17:27
Payment down
Dec 02 17:15
Production Started
Dec 20 11:04
Production Completed
Jan 03 16:47
Progress: 0/6
Engineering Review time: 16.1d Multiple File Revisions
Production time: 14.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 11.8d
Carrier
DHL
Destination
DENMARK
Shipping Method
Express Air
Shipping Time
Jan 15 10:44

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 8-layer FR-4 PCB was built on TG170 material with a finished thickness of 1.6 mm and overall dimensions of 77.5 × 60 mm. The stack featured 0.5 oz outer copper and 1 oz inner layers, 0.1 mm minimum hole size, 5 mil line/space, and blind/buried vias. Ten pieces were produced as single boards with ENIG surface finish and delivered after 100% flying probe testing within a 9-day lead time. The presence of buried vias (layers 2-7) and tight geometry required careful stackup planning and lamination control to maintain registration and interlayer reliability.

 

DFM and EQ communications addressed several file discrepancies. Customer-provided data showed conflicting board thickness values and an unopenable ODB file. Stackup was optimized with adjusted PP and core thicknesses using two separate cores to accommodate the buried via structure, while process edges were corrected from left-right to up-down orientation per production requirements. Markings including serial numbers and customer symbols were added on the top solder mask layer with copper-exposed openings after confirmation of Gerber-format details and white ink contrast. These stackup optimization and process edge adjustments ensured manufacturability without compromising via reliability or dimensional accuracy.

 

All ten boards passed final electrical testing, micro-section analysis, and visual inspection. Delivered with test reports, certificate of conformity, and confirmed stackup documentation. The order was completed with stable thickness control and clean via formation on this compact, high-layer-count configuration.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-094 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail

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