| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 40.6 x 152.4 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Black | Silkscreen | None |
| Stack-up | Default | Impedance Control | No |
This order comprised 80 panels of standard 4-layer FR4 PCB with immersion gold ENIG surface finish. Boards measured 105 × 85 mm, built to 1.6 mm thickness using 1 oz outer copper and 0.5 oz inner copper. Minimum track and spacing of 6 mil kept the geometry within conventional parameters, while the specified via sizes down to 0.3 mm required careful drilling and plating sequences to maintain reliability.
Engineering review confirmed stack-up balance before material preparation and inner layer imaging. Layer stack alignment and high pressure lamination produced flat panels with stable registration. Solder mask application was followed by electroless nickel deposition and immersion gold deposition under controlled chemistry to ensure even coverage and low contact resistance across the batch.
Electrical testing verified every board prior to shipment. The complete cycle took 5.9 days and delivered consistent solder mask alignment, plating thickness, and dimensional accuracy suited to standard SMT assembly. All panels met the customer’s drawings without deviation.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260520-046 | FR4 PCB | 2 | 94.21 x 275 | Green | ENIG (Immersion Gold) | 75 | View detail |
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260506-017 | FR4 PCB | 6 | 55 x 41.7 | Green | ENIG (Immersion Gold) | 15 | View detail |