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6 Layer FR4 PCB Production Record #FR4-20260115-009

FR4 PCB 6 Layers ENIG (Immersion Gold) Yes Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 40.6 x 152.4 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Black Silkscreen None
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Jan 10 01:35
Files Ready
Jan 10 01:35
Engineering Review Completed
Jan 10 01:52
Payment down
Jan 10 01:55
Production Started
Jan 10 01:57
Production Completed
Jan 15 21:15
Progress: 0/6
Engineering Review time: 0.3 h
Production time: 5.9d With Engineering Questions

Logistics Information

Production Completed→Shipping : 3 min
Carrier
DHL
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Jan 15 21:17

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This order comprised 80 panels of standard 4-layer FR4 PCB with immersion gold ENIG surface finish. Boards measured 105 × 85 mm, built to 1.6 mm thickness using 1 oz outer copper and 0.5 oz inner copper. Minimum track and spacing of 6 mil kept the geometry within conventional parameters, while the specified via sizes down to 0.3 mm required careful drilling and plating sequences to maintain reliability.

Engineering review confirmed stack-up balance before material preparation and inner layer imaging. Layer stack alignment and high pressure lamination produced flat panels with stable registration. Solder mask application was followed by electroless nickel deposition and immersion gold deposition under controlled chemistry to ensure even coverage and low contact resistance across the batch.

Electrical testing verified every board prior to shipment. The complete cycle took 5.9 days and delivered consistent solder mask alignment, plating thickness, and dimensional accuracy suited to standard SMT assembly. All panels met the customer’s drawings without deviation.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-095 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail

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