6 Layer FR4 PCB Production Record #FR4-20260506-017
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 15 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 55 x 41.7 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | Yes |
For this order, we fabricated a 6-layer impedance controlled PCB using FR4 material in panel configuration. The boards measured 55 x 41.7 mm with a finished thickness of 1.6 mm and 1 oz copper weight. Featuring a minimum trace width and spacing of 6 mil along with 0.3 mm holes, the design required precise impedance control. Engineering review and stackup impedance engineering were performed to establish the correct layer configuration and dielectric thicknesses.
During inner layer processing, trace width compensation was applied to achieve the target impedance values after lamination. High pressure lamination bonded the layers with accurate alignment, followed by solder mask application in green, white silkscreen printing, electroless nickel deposition, and immersion gold deposition to create a durable immersion gold ENIG surface finish.
Subsequent TDR impedance testing confirmed compliance with the specified requirements, and electrical testing verified circuit integrity across all 15 panels. This execution resulted in reliable boards delivered with consistent quality and performance.
This order also received positive feedback from the customer regarding the consistent quality and reliable delivery. View the full customer review→
Six layer FR4 boards provide optimized routing density and power distribution. They require precise lamination and plating process control to maintain yield and reliability.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260520-046 | FR4 PCB | 2 | 94.21 x 275 | Green | ENIG (Immersion Gold) | 75 | View detail |
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
