| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 200 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 187 x 313 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This order consisted of standard 4-layer FR4 PCBs built with impedance control and an immersion gold ENIG surface finish. The panels measured 150 × 100 mm with 1.6 mm finished thickness and 1 oz copper weight across all layers. Minimum 5 mil track and spacing required exacting inner layer imaging, circuit imaging and etching to hold geometries within tolerance while preserving signal integrity for the controlled impedance design.
Material preparation and layer stack alignment were executed prior to high pressure lamination to ensure registration accuracy across the four layers. Solder mask application was followed by electroless nickel deposition and immersion gold deposition, producing a uniform, oxidation-resistant finish suited to fine-pitch assembly. The full sequence from engineering review through electrical testing was completed in 9.4 days.
Every board underwent netlist verification and impedance measurement, confirming all parameters stayed within specified limits. The resulting multilayer PCBs exhibited consistent plating thickness, clean hole walls, and reliable layer bonding, delivering a stable platform for the customer’s next assembly stage.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260427-053 | FR4 PCB | 4 | 96.1 x 187 | Green | ENIG (Immersion Gold) | 125 | View detail |