| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 200 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 187 x 313 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This order consisted of 200 standard 4-layer FR4 PCBs fabricated in panel configuration. Each panel measured 187 x 313 mm and maintained a finished thickness of 1.6 mm with 1 oz copper layers. The minimum track and spacing of 6/6 mil combined with 0.3 mm hole sizes represented conventional geometry, while the ENIG immersion gold surface finish served as a key differentiator for corrosion resistance and solder performance. We conducted thorough engineering review to confirm the default stackup would support the panel size during high pressure lamination.
Subsequent processes included precise circuit imaging and etching for the inner layers, followed by solder mask application in green and white silkscreen printing. The electroless nickel deposition and immersion gold deposition steps were executed to produce a uniform ENIG coating across all boards. Electrical testing of the complete batch verified continuity and ensured no shorts were present.
Completed in 9.4 days, the production delivered consistent panel PCBs that align with expected reliability for this specification set. The absence of impedance requirements allowed focus on maintaining registration accuracy and surface quality throughout the run.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |