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4 Layer FR4 PCB Production Record #FR4-20260116-007

FR4 PCB 4 Layers ENIG (Immersion Gold) Impedance Control Small Volume
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 200 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 187 x 313 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Jan 06 22:31
Files Ready
Jan 06 22:57
Engineering Review Completed
Jan 07 10:48
Payment down
Jan 06 22:31
Production Started
Jan 07 10:48
Production Completed
Jan 16 19:57
Progress: 0/6
Engineering Review time: 0.3 h
Production time: 9.4d

Logistics Information

Production Completed→Shipping : 6 min
Carrier
DHL
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Jan 16 20:02

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This order consisted of standard 4-layer FR4 PCBs built with impedance control and an immersion gold ENIG surface finish. The panels measured 150 × 100 mm with 1.6 mm finished thickness and 1 oz copper weight across all layers. Minimum 5 mil track and spacing required exacting inner layer imaging, circuit imaging and etching to hold geometries within tolerance while preserving signal integrity for the controlled impedance design.

Material preparation and layer stack alignment were executed prior to high pressure lamination to ensure registration accuracy across the four layers. Solder mask application was followed by electroless nickel deposition and immersion gold deposition, producing a uniform, oxidation-resistant finish suited to fine-pitch assembly. The full sequence from engineering review through electrical testing was completed in 9.4 days.

Every board underwent netlist verification and impedance measurement, confirming all parameters stayed within specified limits. The resulting multilayer PCBs exhibited consistent plating thickness, clean hole walls, and reliable layer bonding, delivering a stable platform for the customer’s next assembly stage.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-095 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail

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