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6 Layer FR4 PCB Production Record #FR4-20260124-013

FR4 PCB 6 Layers ENIG (Immersion Gold) Impedance Control 4/4mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 131 x 170 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Dec 23 10:11
Files Ready
Dec 23 10:11
Engineering Review Completed
Dec 23 10:33
Payment down
Dec 23 21:47
Production Started
Dec 23 22:18
Production Completed
Jan 08 17:45
Progress: 0/6
Engineering Review time: 0.4 h Multiple File Revisions
Production time: 15.9d With Engineering Questions

Logistics Information

Production Completed→Shipping : 15.7d
Carrier
DHL
Destination
DENMARK
Shipping Method
Express Air
Shipping Time
Jan 24 10:04

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This record documents the production of a standard 4-layer FR4 PCB batch with immersion gold ENIG finish. The order comprised 85 panels of 125 x 85 mm boards at 1.6 mm thickness, using 1 oz copper throughout. Minimum track and spacing followed a conventional 6 mil geometry, while impedance controlled traces on inner layers added a layer of precision to the stack-up and required specific dielectric considerations during lamination.

We initiated the run with engineering review and material preparation using TG150 FR4. Inner layer imaging, etching, and accurate layer registration preceded high pressure lamination. Following solder mask application, electroless nickel deposition and immersion gold deposition were performed under controlled conditions to achieve uniform coverage and avoid nickel corrosion risks on the impedance controlled PCB.

Subsequent electrical testing validated all circuits, confirming the boards performed to specification with no opens or shorts. Completed in 15.9 days, the process yielded consistent boards ready for reliable assembly and long-term field performance.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-095 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail

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