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6 Layer FR4 PCB Production Record #FR4-20260126-075

FR4 PCB 6 Layers HASL Lead Free Yes Small Volume
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 200 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 500 x 92 mm Copper Weight 1oz
Thickness 2.4 mm Min Track / Spacing 6/6mil↑
Surface Finish HASL Lead Free Min Hole Size 0.3mm↑
Solder Mask Blue Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Jan 12 20:57
Files Ready
Jan 12 21:09
Engineering Review Completed
Jan 12 22:01
Payment down
Jan 14 17:00
Production Started
Jan 14 17:04
Production Completed
Jan 26 21:52
Progress: 0/6
Engineering Review time: 0.9 h Multiple File Revisions
Production time: 12.2d With Engineering Questions

Logistics Information

Production Completed→Shipping : 1.1 h
Carrier
DHL
Destination
BELGIUM
Shipping Method
Express Air
Shipping Time
Jan 26 22:53

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Molten Solder Coating
09
Hot Air Leveling
10
Electrical Testing

Manufacturing Summary

This order consisted of standard 4-layer FR4 PCBs built on 1.6 mm core material with 1 oz copper on all layers. Minimum trace width and spacing of 6 mil placed the geometry in the conventional range, allowing stable inner layer imaging, etching, and registration during stack alignment. High pressure lamination consolidated the layers with measured resin flow, producing flat panels free of delamination or resin starvation while maintaining overall thickness tolerance.

Solder mask was applied in standard green, followed by molten solder coating and hot air leveling to deposit a uniform HASL Lead Free finish. The process parameters were adjusted for this panel size to avoid solder bridging on the 0.3 mm holes and to ensure even coating across the surface. Every panel completed 100 % electrical testing, confirming net continuity and isolation before final routing.

The 12.2-day production window permitted sequential quality checks at each stage, resulting in consistent solder mask alignment and copper integrity across the full batch. These boards left the line ready for reliable assembly and long-term field performance.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260425-090 FR4 PCB 2 406.4 x 660.4 Matte Black ENIG (Immersion Gold) 5 View detail
FR4-20260418-085 FR4 PCB 6 32 x 46 Green ENIG (Immersion Gold) 15 View detail

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