| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 200 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 500 x 92 mm | Copper Weight | 1oz |
| Thickness | 2.4 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | HASL Lead Free | Min Hole Size | 0.3mm↑ |
| Solder Mask | Blue | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This order consisted of standard 4-layer FR4 PCBs built on 1.6 mm core material with 1 oz copper on all layers. Minimum trace width and spacing of 6 mil placed the geometry in the conventional range, allowing stable inner layer imaging, etching, and registration during stack alignment. High pressure lamination consolidated the layers with measured resin flow, producing flat panels free of delamination or resin starvation while maintaining overall thickness tolerance.
Solder mask was applied in standard green, followed by molten solder coating and hot air leveling to deposit a uniform HASL Lead Free finish. The process parameters were adjusted for this panel size to avoid solder bridging on the 0.3 mm holes and to ensure even coating across the surface. Every panel completed 100 % electrical testing, confirming net continuity and isolation before final routing.
The 12.2-day production window permitted sequential quality checks at each stage, resulting in consistent solder mask alignment and copper integrity across the full batch. These boards left the line ready for reliable assembly and long-term field performance.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260425-090 | FR4 PCB | 2 | 406.4 x 660.4 | Matte Black | ENIG (Immersion Gold) | 5 | View detail |
| FR4-20260418-085 | FR4 PCB | 6 | 32 x 46 | Green | ENIG (Immersion Gold) | 15 | View detail |