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6 Layer FR4 PCB Production Record #FR4-20260418-085

FR4 PCB 6 Layers ENIG (Immersion Gold) Impedance Control 0.1mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 15 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 32 x 46 mm Copper Weight 1oz
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.1mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Mar 25 21:11
Files Ready
Mar 25 21:11
Engineering Review Completed
Mar 25 22:00
Payment down
Mar 26 18:23
Production Started
Mar 31 10:19
Production Completed
Apr 18 14:07
Progress: 0/6
Engineering Review time: 0.8 h Multiple File Revisions
Production time: 18.2d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.4 h
Carrier
DHL
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Apr 18 14:28

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 6-layer HDI PCB was produced on 1.0mm FR-4 S1000H TG150 material with 0.5oz/1oz copper weight and ENIG surface finish. The board measures 32×46mm with 0.1mm minimum holes, 6mil line width/spacing, and 2-stage HDI construction featuring blind vias. A total of 15 pieces (5 sets) were fabricated using a customer-updated Gerber that required complete stackup redesign to JP06101H-3313A2. Production followed standard 21-day lead time with 100% flying probe testing and mechanical routing via stamp holes.

 

Key DFM challenges centered on solder mask bridge integrity and via handling. Multiple SMD pads showed spacing below 5.9mil process capability, risking incomplete solder mask coverage. BGA vias specified at 0.1mm were enlarged to 0.2mm to ensure reliable drilling and maintain adequate pad area for assembly. Inner layer copper density was notably low in L3, prompting auxiliary copper balancing on process edges to prevent resin starvation and warpage during lamination. Non-functional pads were removed where electrically safe, and all unopened vias received solder mask plugging per specification. Panelization was optimized from the original 1×3 layout to 3×2 configuration to reduce material waste while maintaining 10mm process margins and R2.0mm corner protection.

 

Stackup confirmation and solder mask bridge and BGA via adjustments were finalized after multiple EQ rounds, with blind via dimple controlled to ≤25μm. Final boards met IPC Class 2 standards with stable electrical performance and acceptable bow/twist. All units passed functional testing and were shipped with performance reports and quality certificates.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-095 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail

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