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6 Layer FR4 PCB Production Record #FR4-20260130-001

FR4 PCB 6 Layers HASL Lead Free Impedance Control Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 494.3 x 247.8 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish HASL Lead Free Min Hole Size 0.3mm↑
Solder Mask Red Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Jan 06 09:29
Files Ready
Jan 06 09:31
Engineering Review Completed
Jan 06 09:33
Payment down
Jan 09 06:45
Production Started
Jan 12 10:08
Production Completed
Jan 16 04:41
Progress: 0/6
Engineering Review time: 2 min
Production time: 3.8d

Logistics Information

Production Completed→Shipping : 14.5d
Carrier
UPS
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Jan 30 16:05

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Molten Solder Coating
09
Hot Air Leveling
10
Electrical Testing

Manufacturing Summary

This order consisted of a standard 4-layer FR4 PCB produced in panels. The boards featured 1.6 mm overall thickness with 1 oz copper on all layers and minimum 6 mil trace width and spacing. These parameters align with conventional manufacturing specifications, enabling efficient processing without requiring advanced geometry controls. During engineering review, we confirmed the stackup and drill requirements before moving into material preparation and inner layer imaging.

Layer stack alignment received particular attention prior to high pressure lamination to maintain registration accuracy across the four layers. Solder mask was applied in standard green color, after which we performed molten solder coating and hot air leveling to achieve a uniform HASL Lead Free finish. This surface treatment supports excellent component attachment while remaining cost-effective for the build quantity.

All boards underwent comprehensive electrical testing to validate circuit integrity. The complete production sequence, from initial review to final output, spanned 3.8 days while delivering consistent results that meet IPC Class 2 standards. This execution reflects the reliable processes used for multilayer boards with HASL Lead Free surface finish.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260430-043 FR4 PCB 6 171.2 x 305 Green HASL Lead Free 5 View detail
FR4-20260429-022 FR4 PCB 6 80 x 200 Green HASL Lead Free 25 View detail
FR4-20260418-085 FR4 PCB 6 32 x 46 Green ENIG (Immersion Gold) 15 View detail

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