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8 Layer FR4 PCB Production Record #FR4-20260205-046

FR4 PCB 8 Layers ENIG (Immersion Gold) Impedance Control Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 30 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 170 x 270 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Jan 21 16:40
Files Ready
Jan 21 16:40
Engineering Review Completed
Jan 23 10:39
Payment down
Jan 21 16:40
Production Started
Jan 23 10:40
Production Completed
Feb 05 17:53
Progress: 0/6
Engineering Review time: 7.8 h Multiple File Revisions
Production time: 13.4d With Engineering Questions

Logistics Information

Production Completed→Shipping : 5 min
Carrier
DHL
Destination
DENMARK
Shipping Method
Express Air
Shipping Time
Feb 05 17:57

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 8-layer FR-4 TG170 PCB (170 × 270 mm, 1.6 mm finished thickness) was produced in a 3-panel array for a total of 30 pieces. Inner layers used 0.5 oz copper and outer layers 1 oz, with 0.3 mm minimum holes, 6 mil trace/space, and ENIG surface finish. The stackup was adjusted during CAM review after confirming material availability—no 0.4 mm cores were in stock—so PP and core thicknesses were optimized to maintain overall thickness and impedance stability while controlling press parameters.

 

Multiple DFM issues were resolved prior to production. Panelization alignment between stamp holes and bridges was corrected to prevent misalignment during routing. Slot and plated hole tolerances were tightened where possible while respecting mechanical limits; non-plated holes were fabricated as specified. Solder mask clearance, legend placement (including added production numbering and factory marks), and process-edge copper balancing were finalized after customer confirmation. ODB file discrepancies and missing layer data (e.g., GM11) were clarified and corrected in the working gerber set.

 

The stackup optimization and panelization alignment decisions ensured reliable lamination and consistent board thickness. All boards passed 100% electrical testing with no rework required. The order was completed within the 12-day lead time and shipped as planned.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-094 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail

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