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ENIG FR4 PCB Production Record #FR4-20260309-026

FR4 PCB 24 Layers ENIG (Immersion Gold) Impedance Control 4/4mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 24 Layers Board Type Single PCB
Dimensions 279.7 x 215.57 mm Copper Weight 1oz
Thickness 3 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.4mm
Solder Mask Red Silkscreen White
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Feb 02 11:52
Files Ready
Feb 02 12:40
Engineering Review Completed
Feb 02 13:39
Payment down
Feb 04 21:06
Production Started
Feb 04 21:08
Production Completed
Mar 09 16:31
Progress: 0/6
Engineering Review time: 0.8 h Multiple File Revisions
Production time: 32.9d With Engineering Questions

Logistics Information

Production Completed→Shipping : 21 min
Carrier
FedEx IP
Destination
ISRAEL
Shipping Method
Express Air
Shipping Time
Mar 09 16:52

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

This 24-layer FR4 PCB order consisted of 5 single boards sized 279.7 × 215.57 mm with a finished thickness of 3.0 mm. Using 0.5 oz / 1 oz copper and ENIG surface finish, the design incorporated impedance control and multiple high-precision features including press-fit holes and extensive back-drilling.

During DFM review, several critical issues were identified: press-fit holes had stringent requirements on finished hole diameter, copper wall thickness, nickel and gold plating; back-drilling required a maximum 4 mil stub length and specific depth control in BGA regions, which are difficult to achieve consistently and could lead to signal integrity problems or mechanical failure if out of spec. Additionally, significant copper density difference between top and bottom layers posed warpage risk on the thick board, via resin plugging conflicted with bottom-side solder mask window design, and solder mask bridge dimensions were below standard capability.

Through detailed engineering clarifications and customer confirmations, process parameters were optimized, including adjusted drilling compensation, plating controls, back-drill programs, and selective plugging strategy. The order was successfully completed within the 33-day window with 100% electrical testing, meeting all impedance, thickness, and mechanical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-094 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail
FR4-20260427-053 FR4 PCB 4 96.1 x 187 Green ENIG (Immersion Gold) 125 View detail

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