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4 Layer FR4 PCB Production Record #FR4-20260311-037

FR4 PCB 4 Layers ENIG (Immersion Gold) Impedance Control Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 143.5 x 196 mm Copper Weight 0.5oz
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Feb 10 18:10
Files Ready
Feb 10 18:10
Engineering Review Completed
Feb 10 18:33
Payment down
Feb 23 16:04
Production Started
Feb 23 16:09
Production Completed
Mar 07 18:37
Progress: 0/6
Engineering Review time: 0.4 h
Production time: 12.2d With Engineering Questions

Logistics Information

Production Completed→Shipping : 4.1d
Carrier
DHL
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Mar 11 18:40

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 143.5 × 196 mm with 0.5 oz copper on inner and outer layers and a 1.0 mm finished thickness using KB-6165F material. Produced in a quantity of 30 pieces as customer self-panelized 3×2 arrays with routing separation, the design featured standard 6 mil line/space, ENIG surface finish, and no process edges. 100% flying probe testing was performed with mechanical forming. The thin copper and multiple edge-related features required careful DFM attention.

 

Several clearance issues were identified during review. Copper features, pads, and non-plated holes sat too close to the board outline, risking edge exposure, burrs, and copper peeling after routing. Stamp hole spacing of 0.2 mm was below reliable thresholds and risked premature panel separation or breakage; adjustments to 0.35 mm spacing with consistent 0.4 mm holes were proposed and confirmed. A plug-in hole with smaller bottom window risked solder mask intrusion. Additional copper on process edges was requested for plating uniformity and warp control. These concerns were resolved through direct file adjustments and confirmations. 

 

Production completed within the 10-day schedule with all parameters verified to specification. The panels maintained good flatness and registration despite the absence of process edges, delivering consistent boards suitable for customer assembly.

 

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260506-017 FR4 PCB 6 55 x 41.7 Green ENIG (Immersion Gold) 15 View detail

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