4 Layer FR4 PCB Production Record #FR4-20260312-048

This 4-layer FR-4 board measured 299.5 × 208 mm with 1 oz copper on inner and outer layers and a standard 1.6 mm finished thickness using KB-6160 TG130 material. Produced in a quantity of 30 pieces as 2×3 customer-panelized arrays with V-cut and routing separation, the design featured 6 mil line/space, ENIG surface finish, and no process edges. No impedance control, blind vias, or resin plugging was required, with mechanical forming and 100% flying probe testing.

DFM review addressed several file and manufacturability concerns. Hole-to-copper spacing violations were resolved by reducing specific hole diameters by 0.05 mm to maintain adequate clearance without compensation. Vias in single-sided pads on the DBR1 layer were processed as non-plated holes. Silkscreen characters fell below the 0.72 mm minimum height, particularly over pads, leading to acceptance of potential incomplete or fuzzy marking. Multiple production file versions were confirmed prior to release. hole size adjustment for copper clearance ensured reliable isolation while preserving design intent and avoiding shorts.

Production completed within the short 4-day turnaround, with all boards meeting dimensional, electrical, and plating specifications. The customer-panelized configuration without process edges required careful handling but delivered consistent results suitable for assembly.