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4 Layer FR4 PCB Production Record #FR4-20260312-048

FR4 PCB 4 Layers ENIG (Immersion Gold) Impedance Control 0.2mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 299.5 x 208 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Feb 23 19:23
Files Ready
Feb 23 19:23
Engineering Review Completed
Mar 03 21:04
Payment down
Feb 24 16:16
Production Started
Mar 03 21:05
Production Completed
Mar 12 02:07
Progress: 0/6
Engineering Review time: 8.1d Multiple File Revisions
Production time: 8.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.6 h
Carrier
FedEx IP
Destination
ITALY
Shipping Method
Express Air
Shipping Time
Mar 12 02:39

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 299.5 × 208 mm with 1 oz copper on inner and outer layers and a standard 1.6 mm finished thickness using KB-6160 TG130 material. Produced in a quantity of 30 pieces as 2×3 customer-panelized arrays with V-cut and routing separation, the design featured 6 mil line/space, ENIG surface finish, and no process edges. No impedance control, blind vias, or resin plugging was required, with mechanical forming and 100% flying probe testing.

 

DFM review addressed several file and manufacturability concerns. Hole-to-copper spacing violations were resolved by reducing specific hole diameters by 0.05 mm to maintain adequate clearance without compensation. Vias in single-sided pads on the DBR1 layer were processed as non-plated holes. Silkscreen characters fell below the 0.72 mm minimum height, particularly over pads, leading to acceptance of potential incomplete or fuzzy marking. Multiple production file versions were confirmed prior to release. hole size adjustment for copper clearance ensured reliable isolation while preserving design intent and avoiding shorts.

 

Production completed within the short 4-day turnaround, with all boards meeting dimensional, electrical, and plating specifications. The customer-panelized configuration without process edges required careful handling but delivered consistent results suitable for assembly.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260506-017 FR4 PCB 6 55 x 41.7 Green ENIG (Immersion Gold) 15 View detail

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