4 Layer FR4 PCB Production Record #FR4-20260323-068
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 700 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 156 x 315 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
This 4-layer FR-4 production run consisted of 8400 pieces (700 sets) at 1.6 mm finished thickness with 1 oz copper on both inner and outer layers. Board size was 156 × 315 mm, panelized 2×6 with V-cut plus scoring for customer self-separation. Minimum hole diameter of 0.2 mm and 6 mil trace/space followed standard geometry, paired with ENIG surface finish and mechanical forming. Production confirmation was completed after verifying the adjusted stackup to meet the specified press requirements while maintaining overall thickness and reliability targets.
Key DFM issues addressed during CAM review included small silkscreen fonts that risked reduced legibility after processing and an empty solder ring opening on one via type where no-copper treatment was confirmed acceptable. To support current balance, additional copper was added to the process edge. stackup and process edge copper adjustments were reviewed and approved prior to release, along with conventional white oil block handling in the absence of QR code requirements. These changes prevented potential etching variation and assembly readability concerns without affecting final electrical performance.
The order completed within the 12-day delivery window with full electrical testing and quality documentation provided. All engineering queries were resolved through direct file confirmations, ensuring consistent panel utilization of 68.25% and reliable high-volume output for the customer's downstream assembly.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260520-046 | FR4 PCB | 2 | 94.21 x 275 | Green | ENIG (Immersion Gold) | 75 | View detail |
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260506-017 | FR4 PCB | 6 | 55 x 41.7 | Green | ENIG (Immersion Gold) | 15 | View detail |
