4 Layer FR4 PCB Production Record #FR4-20260325-108
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 10 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 105 x 209 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
This 4-layer FR-4 PCB was manufactured in a quantity of 100 pieces using TG150 material at 1.6 mm finished thickness with 1 oz copper throughout. Board dimensions measured 105 × 209 mm in a 2×5 panel arrangement, featuring 6 mil minimum line width and spacing, ENIG surface finish, green solder mask, and white silkscreen. The design required mechanical routing with customer-provided panelization, and 100% flying probe testing confirmed electrical performance within the 9-day lead time.
Multiple DFM clarifications were addressed before release. Panel dimensions were reconciled between provided files and actual Gerbers at 105 × 209 mm. Process edge fiducials and optical points were reviewed for SMT compatibility, with confirmation on top and bottom layer placement. The primary production concern involved the 0.8 mm routing tabs, which presented a high risk of premature panel separation or damage during handling and depanelization. Stackup was verified per the single provided file at 1.6 mm ±10%, and FAB layer copper clearance indicators were confirmed to avoid unwanted features near critical areas.
Tab dimensions and panel handling procedures were optimized after confirmation to ensure panel stability through lamination, plating, and routing stages. Production maintained tight registration and consistent surface finish quality across the batch. Detailed records of the panelization tab strength optimization applied to this order provide further reference for similar multi-up FR-4 executions.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-078 | FR4 PCB | 4 | 119 x 210 | Green | OSP | 100 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
