| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 20 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 29.46 x 30.23 mm | Copper Weight | 1oz |
| Thickness | 0.4 mm | Min Track / Spacing | 3/3mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.15mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This compact 4-layer FR-4 board measured 29.46 × 30.23 mm with 1 oz copper on inner and outer layers and a thin 0.4 mm finished thickness using Shengyi S1000-2M TG170 material. Produced in a quantity of 20 pieces as 2×2 panels, the design incorporated a tight 3 mil line/space, 0.15 mm holes, blind vias, resin plugging, and ENIG surface finish with 4 mm process edges on top and bottom. No impedance control was required, with mechanical forming and 100% flying probe testing.
DFM review confirmed the stackup for the target board thickness and addressed multiple customer requirements including serial number addition from PN1 to PN20 with flexible layer positioning. Laser QR code marking was evaluated against PDF instructions. The primary challenge involved BGA areas with original 3.94 mil pitch, where compensation reduced mask bridge capability to approximately 2.94 mil, creating a high risk of solder bridging and shorts during assembly. Open window discrepancies with stencil layers were reconciled, and production files were finalized after clarification. tight pitch solder mask bridge control was applied to optimize opening sizes and prevent bridging while maintaining pad protection.
The order completed successfully with all boards meeting dimensional, electrical, and visual specifications. The small panel format and thin construction maintained excellent registration and surface quality throughout fabrication, supporting reliable downstream assembly for this low-volume run.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260520-046 | FR4 PCB | 2 | 94.21 x 275 | Green | ENIG (Immersion Gold) | 75 | View detail |
| FR4-20260519-001 | FR4 PCB | 10 | 67.6 x 42 | Green | Gold Plating | 20 | View detail |
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |