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4 Layer FR4 PCB Production Record #FR4-20260331-072

FR4 PCB 4 Layers ENIG (Immersion Gold) Impedance Control 3/3mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 29.46 x 30.23 mm Copper Weight 1oz
Thickness 0.4 mm Min Track / Spacing 3/3mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.15mm
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Feb 13 22:31
Files Ready
Feb 13 22:40
Engineering Review Completed
Feb 14 17:56
Payment down
Feb 26 12:05
Production Started
Feb 26 13:38
Production Completed
Mar 20 17:44
Progress: 0/6
Engineering Review time: 0.6 h Multiple File Revisions
Production time: 22.2d With Engineering Questions

Logistics Information

Production Completed→Shipping : 10.9d
Carrier
UPS
Destination
AUSTRALIA
Shipping Method
Express Air
Shipping Time
Mar 31 14:46

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

 

This compact 4-layer FR-4 board measured 29.46 × 30.23 mm with 1 oz copper on inner and outer layers and a thin 0.4 mm finished thickness using Shengyi S1000-2M TG170 material. Produced in a quantity of 20 pieces as 2×2 panels, the design incorporated a tight 3 mil line/space, 0.15 mm holes, blind vias, resin plugging, and ENIG surface finish with 4 mm process edges on top and bottom. No impedance control was required, with mechanical forming and 100% flying probe testing.

 

DFM review confirmed the stackup for the target board thickness and addressed multiple customer requirements including serial number addition from PN1 to PN20 with flexible layer positioning. Laser QR code marking was evaluated against PDF instructions. The primary challenge involved BGA areas with original 3.94 mil pitch, where compensation reduced mask bridge capability to approximately 2.94 mil, creating a high risk of solder bridging and shorts during assembly. Open window discrepancies with stencil layers were reconciled, and production files were finalized after clarification. tight pitch solder mask bridge control was applied to optimize opening sizes and prevent bridging while maintaining pad protection.

 

The order completed successfully with all boards meeting dimensional, electrical, and visual specifications. The small panel format and thin construction maintained excellent registration and surface quality throughout fabrication, supporting reliable downstream assembly for this low-volume run.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260519-001 FR4 PCB 10 67.6 x 42 Green Gold Plating 20 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail

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