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2 Layer FR4 PCB Production Record #FR4-20260428-012

FR4 PCB 2 Layers ENIG (Immersion Gold) Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 286 x 141 mm Copper Weight 2oz
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Mar 31 10:05
Files Ready
Mar 31 10:13
Engineering Review Completed
Mar 31 10:47
Payment down
Mar 31 17:42
Production Started
Apr 01 09:10
Production Completed
Apr 25 14:21
Progress: 0/6
Engineering Review time: 0.6 h Multiple File Revisions
Production time: 24.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 3.3d
Carrier
FedEx IP
Destination
UNITED KINGDOM
Shipping Method
Express Air
Shipping Time
Apr 28 20:40

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Thick Copper Electroplating
05
Controlled Copper Etching
06
Solder Mask Application
07
Electroless Nickel Deposition
08
Immersion Gold Deposition
09
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board (286 × 141 mm, 1.0 mm finished thickness) was produced in a quantity of 20 pieces (5 sets) using Shengyi S1000-2M TG170 material with 1 oz / 2 oz copper. The design featured 0.3 mm minimum holes, 6 mil line width/space, ENIG surface finish (2U"), aluminum-plugged vias, and customer 1×4 panelization with V-CUT. Production was completed in 14 days with 100% flying probe testing and delivery of electrical test reports plus quality certificates.

 

DFM review addressed panel dimension and via plugging requirements. The panel size was confirmed at 141 × 288 mm including process edges to maintain structural integrity during V-CUT processing. Specific vias were processed with copper paste plugging while others received standard tenting per customer instructions. Silkscreen characters overlapping pads were noted with limited adjustment possible due to design constraints. Factory code and UL marking were added in the designated top layer box, with date code placed only on the bottom side to avoid interference. All marking positions and file details were verified before production release.

 

The completed boards met dimensional, plating, and electrical requirements with consistent via fill and clean depanelization. For detailed handling of the via copper paste plugging and panel dimension conflict in this build, refer to the related engineering case.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260519-001 FR4 PCB 10 67.6 x 42 Green Gold Plating 20 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail

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