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4 Layer FR4 PCB Production Record #FR4-20260512-016

FR4 PCB 4 Layers ENIG (Immersion Gold) 0.2mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 63.5 x 127 mm Copper Weight 2oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Apr 21 04:46
Files Ready
Engineering Review Completed
Apr 21 05:19
Payment down
Apr 24 18:12
Production Started
Apr 24 18:12
Production Completed
May 12 15:19
Progress: 0/6
Engineering Review time: 0.6 h Multiple File Revisions
Production time: 17.9d With Engineering Questions

Logistics Information

Production Completed→Shipping : 3 min
Carrier
DHL
Destination
GERMANY
Shipping Method
Express Air
Shipping Time
May 12 15:22

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Thick Copper Electroplating
08
Controlled Copper Etching
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Electrical Testing

Manufacturing Summary

 

This 4-layer FR-4 board measured 63.5 × 127 mm with 1 oz inner and 2 oz outer copper and a 1.6 mm finished thickness using Shengyi S1000-2M TG170 material. Produced in a quantity of 10 pieces as single boards with V-cut separation, the design incorporated 6 mil line/space, blind vias standardized to 0.15 mm laser drilling, ENIG surface finish, and via tenting. The mixed copper weight and HDI stage 1 construction required precise stackup control for this small run.

 

DFM review confirmed the stackup for target board and copper thickness tolerances. Solder mask data was prioritized over paste layer discrepancies to ensure accurate opening sizes. Production numbering was added solely to the silkscreen layer as specified. Blind hole diameters from the original files were uniformly adjusted to 0.15 mm for laser drilling consistency. Via tenting followed the order requirements for plugged processing. SMT layer optimizations were applied and verified. These adjustments maintained design intent while addressing manufacturability limits for the mixed copper configuration.

 

All boards completed 100% flying probe testing successfully within the 17-day schedule. The final panels delivered consistent registration, plating, and surface quality suitable for assembly despite the blind via and copper weight considerations.

 

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260519-001 FR4 PCB 10 67.6 x 42 Green Gold Plating 20 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail

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