| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 10 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 63.5 x 127 mm | Copper Weight | 2oz |
| Thickness | 1.6 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
This 4-layer FR-4 board measured 63.5 × 127 mm with 1 oz inner and 2 oz outer copper and a 1.6 mm finished thickness using Shengyi S1000-2M TG170 material. Produced in a quantity of 10 pieces as single boards with V-cut separation, the design incorporated 6 mil line/space, blind vias standardized to 0.15 mm laser drilling, ENIG surface finish, and via tenting. The mixed copper weight and HDI stage 1 construction required precise stackup control for this small run.
DFM review confirmed the stackup for target board and copper thickness tolerances. Solder mask data was prioritized over paste layer discrepancies to ensure accurate opening sizes. Production numbering was added solely to the silkscreen layer as specified. Blind hole diameters from the original files were uniformly adjusted to 0.15 mm for laser drilling consistency. Via tenting followed the order requirements for plugged processing. SMT layer optimizations were applied and verified. These adjustments maintained design intent while addressing manufacturability limits for the mixed copper configuration.
All boards completed 100% flying probe testing successfully within the 17-day schedule. The final panels delivered consistent registration, plating, and surface quality suitable for assembly despite the blind via and copper weight considerations.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260520-046 | FR4 PCB | 2 | 94.21 x 275 | Green | ENIG (Immersion Gold) | 75 | View detail |
| FR4-20260519-001 | FR4 PCB | 10 | 67.6 x 42 | Green | Gold Plating | 20 | View detail |
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |