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High Tg FR4 PCB Production Record #FR4-20260519-001

FR4 PCB 10 Layers Gold Plating Impedance Control Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 10 Layers Board Type Panel PCB
Dimensions 67.6 x 42 mm Copper Weight 1oz
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish Gold Plating Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Apr 08 00:12
Files Ready
Apr 08 00:12
Engineering Review Completed
Apr 08 01:29
Payment down
Apr 16 00:58
Production Started
Apr 16 11:16
Production Completed
May 08 17:02
Progress: 0/6
Engineering Review time: 0.5 h Multiple File Revisions
Production time: 22.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 11.2d
Carrier
DHL
Destination
CANADA
Shipping Method
Express Air
Shipping Time
May 19 19:46

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
TDR Impedance Testing
11
Electrical Testing

Manufacturing Summary

This 10-layer FR-4 board (67.6 × 42 mm, 1.0 mm finished thickness, TG170 S1000-2M material) was produced in a 2×2 panel arrangement for a total of 20 pieces. Outer copper was 1 oz with 0.5 oz inner layers, 6/6 mil minimum line/space, 0.3 mm minimum hole size, and full 100% flying probe testing. Key process requirements included impedance control, one-side half-cut holes, V-scoring, green solder mask, white legend, and electroplated gold finish with gold finger beveling. Resin plugging was applied to specified vias per final confirmation.

 

During DFM review, several engineering questions required resolution. Via plugging confirmation was needed for 32 × 0.2 mm through vias with double-sided opening and six 0.406 mm holes. Gold finger beveling presented edge proximity challenges; our minimum 0.3 ± 0.1 mm bevel depth resulted in approximately 0.25 mm finger edge reduction to avoid copper exposure. Impedance lines specified in documentation were not located in the provided files; we recalculated using actual Gerber trace widths and adjusted target board thickness to 1.13 mm ±10% to achieve required values, with inner layer single-ended lines limited to 46 Ω due to dielectric and geometry constraints.

 

All engineering questions were confirmed with the customer prior to production release. The order completed within the 23-day delivery window with mechanical forming for the final panels. Electrical testing, quality documentation, and shipment records confirm full compliance with the specified parameters and controlled processes.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260428-012 FR4 PCB 2 286 x 141 Green ENIG (Immersion Gold) 5 View detail

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