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2 Layer FR4 PCB Production Record #FR4-20260709-057

FR4 PCB 2 Layers OSP 0.2mm vias Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 378 x 258 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish OSP Min Hole Size 0.2mm
Solder Mask White Silkscreen Black
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Jun 19 03:36
Files Ready
Jun 19 03:36
Engineering Review Completed
Jun 19 04:32
Payment down
Jun 25 04:07
Production Started
Jul 01 11:37
Production Completed
Jul 09 14:43
Progress: 0/6
Engineering Review time: 0.8 h Multiple File Revisions
Production time: 8.2d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.5 h
Carrier
FedEx IP
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
Jul 09 15:11

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Solder Mask Application
05
Organic Coating Application
06
Anti-Oxidation Treatment
07
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board measured 378 × 258 mm with 1.6 mm thickness, TG150 material, and 1 oz copper on both sides. Produced as 1800 pieces in 6×15 panels for 20 sets, the order used OSP surface finish, cold white solder mask, and black silkscreen. Line/space remained at standard 6 mil with 0.2 mm minimum holes, and the 12-day schedule included 100% flying probe testing together with routing separation on the high-density panel layout.

 

DFM review resolved several attribute and panel details. Multiple holes were defined as plated through-hole yet showed undersized or missing pads with no electrical connection in the Gerber data, requiring confirmation of plating intent. Board thickness values appeared inconsistent and were aligned to the nominal 1.6 mm specification. The customer panel drawing lacked routing clearance, so a standard 2 mm slot was proposed and confirmed. Stamp-hole-only data conflicted with the PDF that showed routing slots; the 2.0 mm slots were added after verification. Via treatment also differed between system-required tenting and equal-size openings in the files.

 

Confirmed hole attributes, panel clearances, and via mask settings were implemented prior to production. The high-volume run achieved consistent OSP surface finish consistency across the dense panels within the planned timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the boards met the specified mechanical and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260708-079 FR4 PCB 2 323.77 x 379.03 White HASL Lead Free 400 View detail
FR4-20260708-015 FR4 PCB 2 15 x 41.7 White HASL Lead Free 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail

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