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2 Layer FR4 PCB Production Record #FR4-20260708-079

FR4 PCB 2 Layers HASL Lead Free Mass Production
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 400 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 323.77 x 379.03 mm Copper Weight 2oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish HASL Lead Free Min Hole Size 0.3mm↑
Solder Mask White Silkscreen Black
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Jun 17 04:17
Files Ready
Jun 17 04:17
Engineering Review Completed
Jun 17 05:04
Payment down
Jun 17 04:27
Production Started
Jun 17 05:06
Production Completed
Jul 08 21:46
Progress: 0/6
Engineering Review time: 0.4 h
Production time: 21.7d With Engineering Questions

Logistics Information

Production Completed→Shipping : 8 min
Carrier
FedEx IP
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
Jul 08 21:53

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Circuit Imaging & Etching
04
Thick Copper Electroplating
05
Controlled Copper Etching
06
Solder Mask Application
07
Molten Solder Coating
08
Hot Air Leveling
09
Panelization Optimization
10
Batch AOI Inspection
11
Yield Control Management
12
Electrical Testing

Manufacturing Summary

This 2-layer FR-4 board measured 323.77 × 379.03 mm with 1.6 mm thickness, TG150 material, and asymmetric copper of 1 oz inner / 2 oz outer. Produced in high volume as 6400 pieces across 8×2 panels for 400 sets, the order used lead-free HASL surface finish, cold white solder mask, and black silkscreen. Line/space remained at standard 6 mil with 0.3 mm minimum holes, and the 3-day schedule included engineering test fixtures together with routing separation.

 

DFM coordination resolved several layout and process details. Via treatments varied between full openings, small windows, and the system-required tenting; the final mask approach was confirmed. Rectangular features on the keepout layer overlapping traces were reviewed for omission. Connection tabs lacked mouse bites, so standard additions were evaluated to aid depanelization. Small white-marked characters risked reduced legibility after processing, and 0.3 mm vias were proposed without compensation to maintain strict original window sizes. Pad geometries showing potential tombstone risk were adjusted for uniform SMT pad sizing.

 

Confirmed via mask, tab, and pad modifications were implemented prior to production. The high-volume run achieved consistent lead-free HASL coverage on the heavier copper side within the accelerated timeline. Full electrical test reports and quality certificates accompanied the shipment, confirming the boards met the specified mechanical and electrical requirements.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260708-015 FR4 PCB 2 15 x 41.7 White HASL Lead Free 5 View detail
FR4-20260630-014 FR4 PCB 2 126 x 145 Green ENIG (Immersion Gold) 10 View detail
FR4-20260628-010 FR4 PCB 2 60 x 120 Green HASL Lead Free 5 View detail

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