2 Layer Flexible PCB Production Record #FPC-20260321-066
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 5 pcs |
| Layers | 2 Layers | Board Type | Panel PCB |
| Dimensions | 609.6 x 250 mm | Copper Weight | 1OZ |
| Thickness | 0.2 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | OSP | Min Hole Size | 0.3mm↑ |
| Solder Mask | White | Silkscreen | Black |
| Material | Rolled Copper | Stiffener | None |
This 2-layer ultra-thin FPC order featured 0.2mm board thickness with 1OZ rolled copper on both sides, OSP surface finish, and overall panel dimensions of 609.6 × 250mm. Production quantity was 150 pieces delivered in 5 sets. The design used standard 6mil line width and spacing with no impedance requirements, laser profiling, and fly-probe testing. Material behavior on such thin flexible substrates required careful attention to dimensional stability throughout the process.
Customer-specified 1×30 panelization presented significant challenges due to the 250mm material width constraint and excessive panel size, leading to uncontrollable shrinkage that would impact downstream SMT assembly and eliminate space for necessary tooling holes. We recommended and confirmed an alternative panel layout of 120 × 619.6mm (14 pieces per panel), which provided better registration control and manufacturability. Silkscreen legibility also required review, as certain small fonts could not be enlarged without compromising overall design intent; the customer accepted the resulting character definition after sample verification.
All engineering adjustments were implemented prior to production release, ensuring stable lamination, accurate registration, and consistent OSP coating. The order completed on schedule with full electrical testing and delivery of performance reports plus quality certificates. For further details on the large panelization DFM adjustments applied here, refer to the supporting engineering documentation.
These circuits deliver reliable interconnects where space constraints and repeated bending demand thin, lightweight constructions with two copper layers.
Explore engineering queries (EQ) in 2 layer flexible PCB manufacturing, including key DFM challenges such as bend design, coverlay alignment, via reliability, and copper balance. Practical insights help improve flexibility performance and production yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260410-059 | Flexible PCB | 2 | 288 x 95 | White | OSP | 5 | View detail |
| FPC-20260325-010 | Flexible PCB | 2 | 64 x 600 | White | OSP | 5 | View detail |
