2 Layer Flexible PCB Production Record #FPC-20260410-059
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 5 pcs |
| Layers | 2 Layers | Board Type | Panel PCB |
| Dimensions | 288 x 95 mm | Copper Weight | 1OZ |
| Thickness | 0.2 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | OSP | Min Hole Size | 0.3mm↑ |
| Solder Mask | White | Silkscreen | Black |
| Material | Rolled Copper | Stiffener | None |
This 2-layer flexible PCB order involved production of 25 pieces at 0.2mm thickness using rolled copper foil with 1oz copper on both sides. Measuring 288 × 95 mm per unit in a 5×1 panel arrangement, the board featured standard 6 mil line width and spacing, OSP surface finish, white coverlay on the top layer, and full open solder mask on the bottom. The thin flexible construction required careful handling during lamination, routing, and panelization to maintain dimensional stability and prevent creasing or tearing.
Key engineering adjustments addressed the flexible panelization requirements, where multiple 1.0 mm connection tabs were added using flexible connection methods instead of rigid breakaways. Process edges received additional copper balancing on both sides to improve rigidity during production. Solder mask openings were revised to match stencil dimensions with single-side 0.05 mm compensation, and date code marking (year only) was incorporated on the process edge. These changes resolved potential issues with coverlay alignment and solder paste registration that could have impacted downstream SMT assembly yields.
Production proceeded smoothly with laser profiling and full electrical testing completed within the 9-day lead time. Final delivery maintained consistent flatness and registration across the thin flex panels. Detailed records of the flex panelization and coverlay process controls used for this order provide further technical reference on similar thin-board executions.
These circuits deliver reliable interconnects where space constraints and repeated bending demand thin, lightweight constructions with two copper layers.
Explore engineering queries (EQ) in 2 layer flexible PCB manufacturing, including key DFM challenges such as bend design, coverlay alignment, via reliability, and copper balance. Practical insights help improve flexibility performance and production yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
