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2 Layer Flexible PCB Production Record #FPC-20260325-010

Flexible PCB 2 Layers OSP Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type Flexible PCB Quantity 5 pcs
Layers 2 Layers Board Type Panel PCB
Dimensions 64 x 600 mm Copper Weight 1OZ
Thickness 0.2 mm Min Track / Spacing 6/6mil↑
Surface Finish OSP Min Hole Size 0.3mm↑
Solder Mask White Silkscreen Black
Material Rolled Copper Stiffener None

Manufacturing Timeline

Order Created
Mar 05 01:24
Files Ready
Mar 05 01:24
Engineering Review Completed
Mar 05 02:45
Payment down
Mar 06 00:36
Production Started
Mar 06 00:40
Production Completed
Mar 25 15:13
Progress: 0/6
Engineering Review time: 1h
Production time: 19.7d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.2 h
Carrier
DHL
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
Mar 25 15:23

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Polyimide Material Handling
04
Circuit Imaging & Etching
05
Coverlay Lamination
06
Solder Mask Application
07
Organic Coating Application
08
Anti-Oxidation Treatment
09
Dynamic Flex Testing
10
Electrical Testing

Manufacturing Summary

 

This 2-layer flexible board measured 64 × 600 mm with 1 oz copper on both sides and an ultra-thin 0.2 mm finished thickness using pressed copper material. Produced as a 20×1 panelized array in a quantity of 100 pieces, the design featured 6 mil line/space, OSP surface finish, white solder mask on both sides, and black silkscreen. Laser forming was used with V-cut separation and no process edges specified by the customer. Full flying probe testing was performed.

 

DFM review identified several production risks. The absence of process edges on both ends increased the likelihood of panel separation during handling and SMT. Traces running flush to the outer edges risked copper burrs, shorts, or edge blackening during laser cutting. Silkscreen character height and openings near pads required verification to prevent blurring or solder mask encroachment. Double-sided white solder mask thickness constraints were addressed, and production files were confirmed after adjustments. Panel handling followed established thin board edge protection practices to maintain integrity throughout processing while respecting the no-edge requirement.

 

The order completed successfully within the 14-day timeline, with all boards meeting dimensional, electrical, and visual specifications. The long, narrow configuration and thin cross-section remained stable during fabrication and testing, delivering consistent results for downstream assembly.

 

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FPC-20260410-059 Flexible PCB 2 288 x 95 White OSP 5 View detail
FPC-20260321-066 Flexible PCB 2 609.6 x 250 White OSP 5 View detail

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