| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | Flexible PCB | Quantity | 5 pcs |
| Layers | 2 Layers | Board Type | Panel PCB |
| Dimensions | 64 x 600 mm | Copper Weight | 1OZ |
| Thickness | 0.2 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | OSP | Min Hole Size | 0.3mm↑ |
| Solder Mask | White | Silkscreen | Black |
| Material | Rolled Copper | Stiffener | None |
This 2-layer flexible board measured 64 × 600 mm with 1 oz copper on both sides and an ultra-thin 0.2 mm finished thickness using pressed copper material. Produced as a 20×1 panelized array in a quantity of 100 pieces, the design featured 6 mil line/space, OSP surface finish, white solder mask on both sides, and black silkscreen. Laser forming was used with V-cut separation and no process edges specified by the customer. Full flying probe testing was performed.
DFM review identified several production risks. The absence of process edges on both ends increased the likelihood of panel separation during handling and SMT. Traces running flush to the outer edges risked copper burrs, shorts, or edge blackening during laser cutting. Silkscreen character height and openings near pads required verification to prevent blurring or solder mask encroachment. Double-sided white solder mask thickness constraints were addressed, and production files were confirmed after adjustments. Panel handling followed established thin board edge protection practices to maintain integrity throughout processing while respecting the no-edge requirement.
The order completed successfully within the 14-day timeline, with all boards meeting dimensional, electrical, and visual specifications. The long, narrow configuration and thin cross-section remained stable during fabrication and testing, delivering consistent results for downstream assembly.
These circuits deliver reliable interconnects where space constraints and repeated bending demand thin, lightweight constructions with two copper layers.
Explore engineering queries (EQ) in 2 layer flexible PCB manufacturing, including key DFM challenges such as bend design, coverlay alignment, via reliability, and copper balance. Practical insights help improve flexibility performance and production yield.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FPC-20260410-059 | Flexible PCB | 2 | 288 x 95 | White | OSP | 5 | View detail |
| FPC-20260321-066 | Flexible PCB | 2 | 609.6 x 250 | White | OSP | 5 | View detail |