Coupons
Help
  • FAQ
    browse most common questions
  • Live Chat
    talk with our online service
  • Email
    contact your dedicated sales:

4 Layer FR4 PCB Production Record #FR4-20251229-013

FR4 PCB 4 Layers ENIG (Immersion Gold) Impedance Control 0.2mm vias Prototype
Start FR4 PCB Quote

PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 4 Layers Board Type Panel PCB
Dimensions 135 x 225 mm Copper Weight 1oz
Thickness 1 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Dec 16 18:08
Files Ready
Dec 16 18:15
Engineering Review Completed
Dec 16 18:24
Payment down
Dec 16 18:26
Production Started
Dec 16 18:29
Production Completed
Dec 20 04:34
Progress: 0/6
Engineering Review time: 2 min
Production time: 3.5d

Logistics Information

Production Completed→Shipping : 9.6d
Carrier
DHL
Destination
POLAND
Shipping Method
Express Air
Shipping Time
Dec 29 18:16

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

This production record documents the manufacturing of a standard 4-layer FR4 PCB featuring impedance control and immersion gold ENIG surface finish. The board utilized a 1.6 mm finished thickness with 1 oz copper on all layers. Minimum track width and spacing stood at 5/5 mil, placing the geometry in the tighter range that requires precise process controls. Engineering review included stackup impedance engineering and trace width compensation to meet the specified electrical requirements.

High pressure lamination followed inner layer imaging and circuit etching, with special attention to layer stack alignment for optimal registration. Solder mask was applied prior to the electroless nickel deposition and immersion gold deposition steps. Post-production, TDR impedance testing validated the controlled impedance values across multiple traces, and comprehensive electrical testing ensured no opens or shorts in the final product.

Completed over 3.5 days, the order was executed with attention to each critical step, resulting in boards that meet both dimensional and performance criteria consistently. This reflects the actual manufacturing sequence used to deliver reliable impedance controlled PCBs.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260512-016 FR4 PCB 4 63.5 x 127 Green ENIG (Immersion Gold) 10 View detail

2026 AIVON.COM All Rights Reserved
Intellectual Property Rights | Terms of Service | Privacy Policy | Refund Policy