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6 Layer FR4 PCB Production Record #FR4-20260109-005

FR4 PCB 6 Layers ENIG (Immersion Gold) Impedance Control 4/4mil Mass Production
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 350 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 157.5 x 137.2 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Dec 23 09:23
Files Ready
Dec 23 09:23
Engineering Review Completed
Dec 23 09:48
Payment down
Dec 24 03:47
Production Started
Dec 24 03:49
Production Completed
Jan 07 16:30
Progress: 0/6
Engineering Review time: 0.3 h
Production time: 14.6d

Logistics Information

Production Completed→Shipping : 2.0d
Carrier
UPS
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Jan 09 15:46

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Panelization Optimization
14
Batch AOI Inspection
15
Yield Control Management
16
Electrical Testing

Manufacturing Summary

This production run delivered 320 pieces of a standard 4-layer FR4 PCB configured for controlled impedance. The boards measured 110 × 85 mm with a finished thickness of 1.6 mm and 1 oz copper weight. Minimum trace and spacing came in at 5 mil, paired with immersion gold ENIG surface finish. These parameters required careful process selection to balance the finer geometry with reliable multilayer registration.

We performed stackup impedance engineering and trace width compensation early in the workflow, followed by inner layer imaging, precise circuit etching, and high pressure lamination. Solder mask was applied prior to electroless nickel and immersion gold deposition. TDR impedance testing on representative samples verified that both 50-ohm and differential pair requirements stayed within tolerance across the batch.

The full sequence, including AOI inspection, electrical testing, and yield control, was completed in 14.6 days. All boards passed final checks with consistent results, confirming the manufacturing execution matched the design intent for this impedance controlled PCB order.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260506-017 FR4 PCB 6 55 x 41.7 Green ENIG (Immersion Gold) 15 View detail

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