| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 350 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 157.5 x 137.2 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | Yes |
This production run delivered 320 pieces of a standard 4-layer FR4 PCB configured for controlled impedance. The boards measured 110 × 85 mm with a finished thickness of 1.6 mm and 1 oz copper weight. Minimum trace and spacing came in at 5 mil, paired with immersion gold ENIG surface finish. These parameters required careful process selection to balance the finer geometry with reliable multilayer registration.
We performed stackup impedance engineering and trace width compensation early in the workflow, followed by inner layer imaging, precise circuit etching, and high pressure lamination. Solder mask was applied prior to electroless nickel and immersion gold deposition. TDR impedance testing on representative samples verified that both 50-ohm and differential pair requirements stayed within tolerance across the batch.
The full sequence, including AOI inspection, electrical testing, and yield control, was completed in 14.6 days. All boards passed final checks with consistent results, confirming the manufacturing execution matched the design intent for this impedance controlled PCB order.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260520-046 | FR4 PCB | 2 | 94.21 x 275 | Green | ENIG (Immersion Gold) | 75 | View detail |
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260506-017 | FR4 PCB | 6 | 55 x 41.7 | Green | ENIG (Immersion Gold) | 15 | View detail |