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6 Layer FR4 PCB Production Record #FR4-20260608-023

FR4 PCB 6 Layers HASL Lead Free Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 25 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 239 x 355 mm Copper Weight 2oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish HASL Lead Free Min Hole Size 0.3mm↑
Solder Mask Black Silkscreen None
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
May 19 04:53
Files Ready
May 19 04:53
Engineering Review Completed
May 29 09:02
Payment down
May 27 19:34
Production Started
May 29 09:03
Production Completed
Jun 06 07:10
Progress: 0/6
Engineering Review time: 10.2d
Production time: 8.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 2.0d
Carrier
FedEx IP
Destination
BRAZIL
Shipping Method
Express Air
Shipping Time
Jun 08 06:53

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Thick Copper Electroplating
08
Controlled Copper Etching
09
Solder Mask Application
10
Molten Solder Coating
11
Hot Air Leveling
12
Electrical Testing

Manufacturing Summary

This 6-layer FR-4 board required careful stackup alignment between customer lamination drawing and standard production configurations. Panelization included V-cut and routing with connection tabs reviewed for stamp hole placement. Small solder mask legend elements were identified as below reliable process capability, while overall layer configuration needed adjustment to match available materials and press parameters for consistent thickness and registration.

 

DFM review highlighted deviations in the proposed lamination stack that could affect interlayer registration and thermal performance. Connection tabs without stamp holes were confirmed as intentional to maintain panel strength during handling. Tiny solder mask characters risked incomplete or illegible marking. After customer feedback on suggested options, the stackup was revised to a manufacturable configuration using standard prepreg and core combinations that preserved electrical and mechanical properties.

 

Revised stackup parameters were implemented and verified before full production release. This multilayer PCB stackup adjustment process ensured reliable pressing and avoided potential delamination or thickness variation. The order completed with 100% electrical testing and standard quality documentation, meeting all functional requirements within the agreed delivery timeframe.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260628-010 FR4 PCB 2 60 x 120 Green HASL Lead Free 5 View detail
FR4-20260619-010 FR4 PCB 2 121 x 121 Green HASL Lead Free 50 View detail
FR4-20260618-018 FR4 PCB 2 54.74 x 106.93 Green HASL Lead Free 5 View detail

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