6 Layer FR4 PCB Production Record #FR4-20260608-023

This 6-layer FR-4 board required careful stackup alignment between customer lamination drawing and standard production configurations. Panelization included V-cut and routing with connection tabs reviewed for stamp hole placement. Small solder mask legend elements were identified as below reliable process capability, while overall layer configuration needed adjustment to match available materials and press parameters for consistent thickness and registration.

DFM review highlighted deviations in the proposed lamination stack that could affect interlayer registration and thermal performance. Connection tabs without stamp holes were confirmed as intentional to maintain panel strength during handling. Tiny solder mask characters risked incomplete or illegible marking. After customer feedback on suggested options, the stackup was revised to a manufacturable configuration using standard prepreg and core combinations that preserved electrical and mechanical properties.

Revised stackup parameters were implemented and verified before full production release. This multilayer PCB stackup adjustment process ensured reliable pressing and avoided potential delamination or thickness variation. The order completed with 100% electrical testing and standard quality documentation, meeting all functional requirements within the agreed delivery timeframe.