PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 4 Layers | Board Type | Panel PCB |
| Dimensions | 119 x 201 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | None |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This order involved production of five 4-layer FR4 panels, each 119 × 201 mm and built to 1.6 mm thickness with 1 oz copper. The 5/5 mil trace width and spacing required precise inner layer imaging, controlled etching, and careful layer stack alignment during high-pressure lamination. Material preparation followed standard FR4 protocols while maintaining registration within tolerance across all panels, even without impedance control.
Green solder mask was applied uniformly before electroless nickel and immersion gold deposition, producing a clean ENIG surface finish on every panel. With no silkscreen specified, process steps concentrated on mask alignment and plating consistency. Final electrical testing verified continuity and isolation on all five panels, confirming the boards met the geometric and functional requirements of this panelized configuration.
The 14.8-day build cycle allowed thorough execution of each manufacturing stage, resulting in stable multilayer boards delivered exactly to specification.
Explore More PCB Manufacturing Resources
Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |
