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ENIG FR4 PCB Production Record #FR4-20260117-008

FR4 PCB 12 Layers ENIG (Immersion Gold) Impedance Control 4/4mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 12 Layers Board Type Panel PCB
Dimensions 82.01 x 100 mm Copper Weight 1.5oz
Thickness 2 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.1mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control Yes

Manufacturing Timeline

Order Created
Dec 26 20:08
Files Ready
Dec 26 20:56
Engineering Review Completed
Dec 26 21:58
Payment down
Dec 27 16:57
Production Started
Dec 27 16:58
Production Completed
Jan 17 15:08
Progress: 0/6
Engineering Review time: 0.5 h
Production time: 21.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 2 min
Carrier
DHL
Destination
SPAIN
Shipping Method
Express Air
Shipping Time
Jan 17 15:10

Key Manufacturing Processes

01
Engineering Review
02
Stackup Impedance Engineering
03
Trace Width Compensation
04
Material Preparation
05
Inner Layer Imaging
06
Circuit Imaging & Etching
07
Layer Stack Alignment
08
High Pressure Lamination
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
TDR Impedance Testing
13
Electrical Testing

Manufacturing Summary

This 12-layer FR-4 board (82.01 × 100 mm, 2.2 mm finished thickness, TG170 S1000-2M material) was built as a single-unit panel for a quantity of 5 pieces. Outer copper was 1 oz on one side and 1.5 oz on the other, with 4 mil minimum line/space, 0.1 mm minimum hole size, and full 100% flying probe testing. The order required impedance control, ENIG surface finish, green solder mask, white legend, and routed outline with 4 mm process edges on all sides. No resin plugging or gold fingers were specified.

 

DFM review identified several critical clarifications. Inner layer naming did not clearly indicate stackup sequence, requiring customer confirmation for correct lamination order. Edge copper features were positioned too close to the board outline, risking copper exposure during routing. Pad geometry showed annular ring asymmetry, with one side lacking sufficient ring; due to the 1.5 oz outer copper and tight geometries, we enlarged the ring on the equal-pad side to support reliable negative imaging. We also addressed tight drill-to-line clearances by trace adjustment and confirmed stackup thickness at 2.2 mm per the press sheet. These points, along with solder bridge acceptance on tight pads and impedance documentation gaps, were resolved through direct file updates and panel revisions. stackup clarification and annular ring asymmetry followed our standard engineering controls for high-layer count boards.

 

All engineering questions received customer confirmation before production release. The order completed within the 15-day delivery window using mechanical forming. Final electrical testing and quality documentation verified compliance with the adjusted parameters and controlled processes.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260519-001 FR4 PCB 10 67.6 x 42 Green Gold Plating 20 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail

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