6 Layer FR4 PCB Production Record #FR4-20260120-022

The manufacturing execution for this impedance controlled 4-layer FR4 PCB centered on achieving precise electrical characteristics. We conducted stackup impedance engineering and applied trace width compensation throughout the inner layer imaging and etching phases. This approach accounted for material behavior and ensured the minimum 5 mil traces and spaces met both dimensional and impedance requirements after high pressure lamination.

Solder mask application preceded the surface finish process, where electroless nickel deposition and immersion gold deposition created a flat, reliable ENIG layer. The boards then advanced to TDR impedance testing, confirming that the differential pairs and single-ended lines performed within specified tolerances, followed by electrical testing for continuity and isolation.

Completed in 5.7 days, this order benefited from the experienced sequencing of processes that maintained layer alignment and overall consistency. Customers can be confident in the resulting PCBs due to the verification steps integrated at key stages of production.