| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 10 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 237.5 x 132 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Matte Black | Silkscreen | Yellow |
| Stack-up | Default | Impedance Control | No |
This job consisted of 10 panels of 6-layer FR4 PCB measuring 237.5 × 132 mm, built to 1.6 mm thickness with 1 oz copper. The 4/4 mil minimum track and spacing required exact control during inner layer imaging, etching, and lamination to hold registration across all layers. Layer stack alignment received particular attention to prevent any shift in the multilayer construction while maintaining standard dielectric spacing.
Matte black solder mask was applied and cured under adjusted parameters to secure uniform thickness and adhesion, followed by yellow silkscreen printing that delivers high contrast on the dark surface. Immersion gold ENIG surface finish was formed through electroless nickel deposition and gold replacement, providing oxidation resistance and reliable solderability on the 0.3 mm minimum holes. Full electrical testing verified net continuity and isolation on every panel before shipment.
The complete sequence from engineering review through final test produced consistent boards that met the specified geometry and finish requirements without deviation, confirming process stability for this tighter-geometry panel order.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |