6 Layer FR4 PCB Production Record #FR4-20260312-006
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 5 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 44 x 28 mm | Copper Weight | 1oz |
| Thickness | 1 mm | Min Track / Spacing | 3/3mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Blue | Silkscreen | White |
| Stack-up | Default | Impedance Control | Yes |
This 6-layer FR-4 board measured 44×28mm with 1.0mm finished thickness and 1oz copper on both inner and outer layers. Built on S1000H material (TG150), the order consisted of 5 pieces (5 sets) using 1×1 panelization. Key specifications included 3 mil minimum trace/space, 0.2mm minimum hole size, ENIG surface finish, impedance control, and second-order HDI construction with blind vias.
During engineering review, multiple DFM issues were resolved. The customer-specified resin via plugging on through holes was confirmed and executed with controlled depth and flatness parameters. Solder mask bridge challenges arose due to pad spacing below 6 mil in original design; openings were adjusted per EQ agreement to maintain solder mask integrity. The provided stackup was optimized for second-order HDI to ensure layer registration and impedance stability. Blind vias exceeding standard laser limits were reviewed and processed within capability boundaries.
After final file confirmation and panelization adjustment to 1×1 with stamp holes plus bridging, production advanced smoothly. All boards underwent 100% flying probe testing and met electrical and impedance requirements. The order was delivered within the 19-day schedule with complete test reports and quality documentation. This build highlighted effective management of compact HDI geometry, resin plugging, and tight solder mask constraints on a standard FR-4 platform.
Six layer FR4 boards provide optimized routing density and power distribution. They require precise lamination and plating process control to maintain yield and reliability.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260505-010 | FR4 PCB | 8 | 88.4 x 90.2 | Green | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260504-095 | FR4 PCB | 8 | 281 x 100 | Green | ENIG (Immersion Gold) | 10 | View detail |
