6 Layer FR4 PCB Production Record #FR4-20260312-006

This 6-layer FR-4 board measured 44×28mm with 1.0mm finished thickness and 1oz copper on both inner and outer layers. Built on S1000H material (TG150), the order consisted of 5 pieces (5 sets) using 1×1 panelization. Key specifications included 3 mil minimum trace/space, 0.2mm minimum hole size, ENIG surface finish, impedance control, and second-order HDI construction with blind vias.

During engineering review, multiple DFM issues were resolved. The customer-specified resin via plugging on through holes was confirmed and executed with controlled depth and flatness parameters. Solder mask bridge challenges arose due to pad spacing below 6 mil in original design; openings were adjusted per EQ agreement to maintain solder mask integrity. The provided stackup was optimized for second-order HDI to ensure layer registration and impedance stability. Blind vias exceeding standard laser limits were reviewed and processed within capability boundaries.

After final file confirmation and panelization adjustment to 1×1 with stamp holes plus bridging, production advanced smoothly. All boards underwent 100% flying probe testing and met electrical and impedance requirements. The order was delivered within the 19-day schedule with complete test reports and quality documentation. This build highlighted effective management of compact HDI geometry, resin plugging, and tight solder mask constraints on a standard FR-4 platform.