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6 Layer FR4 PCB Production Record #FR4-20260314-090

FR4 PCB 6 Layers ENIG (Immersion Gold) Impedance Control Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 5 pcs
Layers 6 Layers Board Type Panel PCB
Dimensions 74.62 x 84.53 mm Copper Weight 2oz
Thickness 1.6 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.25mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Jan 13 22:12
Files Ready
Jan 13 22:12
Engineering Review Completed
Jan 13 22:27
Payment down
Feb 05 18:24
Production Started
Feb 24 14:36
Production Completed
Mar 11 14:23
Progress: 0/6
Engineering Review time: 10 min Multiple File Revisions
Production time: 15.0d With Engineering Questions

Logistics Information

Production Completed→Shipping : 3.1d
Carrier
DHL
Destination
ITALY
Shipping Method
Express Air
Shipping Time
Mar 14 14:48

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Thick Copper Electroplating
08
Controlled Copper Etching
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Electrical Testing

Manufacturing Summary

This 6-layer FR-4 board (74.62 × 84.53 mm, 1.6 mm finished thickness) was produced as 5 pieces using KB-6165F TG150 material with 2 oz copper on both inner and outer layers. The design featured 0.25 mm minimum holes, 6 mil line width/space, ENIG surface finish, via tenting, and AIVON panelization with 4 mm process edges on top and bottom. Production was completed in 14 days with 100% flying probe testing and delivery of electrical test reports plus quality certificates.

 

DFM review identified several manufacturability concerns. Tight board edge clearances risked exposed copper after routing and were adjusted per customer feedback. Multiple vias positioned directly on pads required clarification to avoid incomplete pads after aluminum plugging. Silkscreen characters overlapping pads were flagged for potential soldering issues. Hole attributes were confirmed for several NPTH locations where drill size matched pads with no connecting traces, and PTH designations were updated on larger holes. Stack-up was aligned with customer-provided structure and available material. Final panelization and production files were verified before release.

 

The boards were delivered meeting all dimensional, plating, and electrical requirements with clean edges and reliable via coverage. For detailed resolution of the edge clearance and hole attribute conflicts in this 2 oz copper build, refer to the related engineering case.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-095 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail

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