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8 Layer FR4 PCB Production Record #FR4-20260420-037

FR4 PCB 8 Layers ENIG (Immersion Gold) Impedance Control 4/4mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 10 pcs
Layers 8 Layers Board Type Panel PCB
Dimensions 130 x 161.6 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.15mm
Solder Mask Blue Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Mar 12 16:38
Files Ready
Mar 12 16:38
Engineering Review Completed
Mar 12 16:56
Payment down
Apr 01 17:41
Production Started
Apr 10 17:25
Production Completed
Apr 20 18:45
Progress: 0/6
Engineering Review time: 0.3 h
Production time: 10.1d With Engineering Questions

Logistics Information

Production Completed→Shipping : 4 min
Carrier
FedEx IP
Destination
CZECH REPUBLIC, THE
Shipping Method
Express Air
Shipping Time
Apr 20 18:49

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 8-layer board used KB-6165F TG150 material at 1.6 mm thickness with 0.5 oz inner and 1 oz outer copper. Measuring 130 × 161.6 mm, the design incorporated blind vias at 0.15 mm laser diameter, 4 mil minimum trace and space, ENIG finish, blue solder mask, and V-cut plus routing separation on a 1×2 panel. Twenty pieces were produced under a 21-day schedule after customer self-panelization.

 

CAM review flagged oversized solder mask openings that eliminated bridges between pads and exposed traces, via capping conflicts on double-sided open holes without tin, non-standard 0.15 mm laser vias, BGA pads requiring non-solder-mask-defined treatment to prevent cratering, and legend frames too close to pads. Additional items included V-cut copper clearance of 0.45 mm per side, process-edge test pads on all four sides, and confirmation of the KB TG150 stack-up. Openings were reduced to restore mask bridges, via plugging requirements were clarified on the production files, BGA pads were redefined, legend positions were adjusted, and V-cut test features were added to the edges.

 

All changes were incorporated before release. One-hundred-percent flying-probe testing was completed, and boards shipped with electrical test reports and quality certificates. The revisions addressed the blind via and solder mask constraints while preserving the specified V-cut process.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260505-010 FR4 PCB 8 88.4 x 90.2 Green ENIG (Immersion Gold) 100 View detail
FR4-20260504-095 FR4 PCB 8 281 x 100 Green ENIG (Immersion Gold) 10 View detail

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