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ENIG FR4 PCB Production Record #FR4-20260430-032

FR4 PCB 12 Layers ENIG (Immersion Gold) Impedance Control 4/4mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 12 Layers Board Type Panel PCB
Dimensions 165.1 x 215.58 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Matte Black Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Feb 26 14:44
Files Ready
Feb 26 14:44
Engineering Review Completed
Feb 26 15:29
Payment down
Mar 07 07:35
Production Started
Mar 10 10:29
Production Completed
Mar 26 16:54
Progress: 0/6
Engineering Review time: 0.8 h Multiple File Revisions
Production time: 16.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 35.0d
Carrier
FedEx IP
Destination
UNITED STATES OF AMERICA
Shipping Method
Express Air
Shipping Time
Apr 30 15:26

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 12-layer FR-4 TG170 PCB was produced in a 1×1 panel format with 4 mm process edges on top and bottom. Finished board size is 165.1 × 215.58 mm at 1.6 mm thickness using Shengyi FR-4 material, 1 oz copper on outer layers, 0.3 mm minimum hole size, and 4 mil line width/spacing. The order consisted of 20 pieces with ENIG surface finish, matte black solder mask on both sides, and white silkscreen. No impedance control was required. Production followed standard 100% flying probe testing and mechanical routing.

 

During DFM review, several engineering questions were resolved to ensure manufacturability. Stackup was adjusted based on our standard 12-layer process capabilities while maintaining the target 1.6 mm thickness. Solder mask clearance issues were addressed where 3 mil openings on traces could not be reliably achieved; these were removed after confirmation. Panelization with optical fiducials and locating holes was verified, and factory markings including UL code and date code were added to the top layer silkscreen as requested. stackup optimization and solder mask clearance handling followed established internal guidelines for this layer count and material.

 

All files were confirmed prior to release into production. The order completed within the 15-day delivery window with full electrical testing and quality documentation provided. Final boards met dimensional, plating, and cosmetic requirements without deviation, supporting reliable downstream assembly.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260519-001 FR4 PCB 10 67.6 x 42 Green Gold Plating 20 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail

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