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4 Layer FR4 PCB Production Record #FR4-20260516-065

FR4 PCB 4 Layers ENIG (Immersion Gold) Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 4 Layers Board Type Single PCB
Dimensions 119 x 98 mm Copper Weight 2oz
Thickness 1.2 mm Min Track / Spacing 6/6mil↑
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.3mm↑
Solder Mask Green Silkscreen White
Stack-up Default Impedance Control No

Manufacturing Timeline

Order Created
Apr 25 18:19
Files Ready
Apr 25 18:36
Engineering Review Completed
Apr 27 16:07
Payment down
Apr 15 14:22
Production Started
Apr 27 16:21
Production Completed
May 15 18:22
Progress: 0/6
Engineering Review time: 1.9d Multiple File Revisions
Production time: 18.1d With Engineering Questions

Logistics Information

Production Completed→Shipping : 0.9d
Carrier
DHL
Destination
SWEDEN
Shipping Method
Express Air
Shipping Time
May 16 14:55

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Thick Copper Electroplating
08
Controlled Copper Etching
09
Solder Mask Application
10
Electroless Nickel Deposition
11
Immersion Gold Deposition
12
Electrical Testing

Manufacturing Summary

This 4-layer FR-4 board measured 119 × 98 mm with 1 oz inner and 2 oz outer copper and a 1.2 mm finished thickness using KB-6165F TG150 material. Produced in a quantity of 20 pieces as single boards, the design featured 6 mil line/space, ENIG surface finish, and blind vias. Finished board thickness markings were added per customer request. The controlled depth milling requirement to expose inner layer pads presented the primary manufacturing consideration.

 

DFM review verified the stackup for the tight 1.2 ± 0.12 mm tolerance. Controlled depth milling was set to approximately 0.78 ± 0.1 mm to precisely reveal L2 and L3 pads, followed by surface treatment on the exposed areas. Production and panelization files were confirmed after iterative updates. Stackup and milling parameters were adjusted to maintain structural integrity while achieving the required exposure without damaging adjacent layers. Controlled depth milling registration ensured accurate depth control and clean pad exposure across the batch.

 

All boards completed 100% flying probe testing successfully within the 27-day schedule. The final parts met dimensional, electrical, and visual specifications, with the depth-milled features providing the intended inner layer access while preserving overall board reliability.

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail
FR4-20260506-017 FR4 PCB 6 55 x 41.7 Green ENIG (Immersion Gold) 15 View detail

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