| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 20 pcs |
| Layers | 4 Layers | Board Type | Single PCB |
| Dimensions | 119 x 98 mm | Copper Weight | 2oz |
| Thickness | 1.2 mm | Min Track / Spacing | 6/6mil↑ |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.3mm↑ |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
This 4-layer FR-4 board measured 119 × 98 mm with 1 oz inner and 2 oz outer copper and a 1.2 mm finished thickness using KB-6165F TG150 material. Produced in a quantity of 20 pieces as single boards, the design featured 6 mil line/space, ENIG surface finish, and blind vias. Finished board thickness markings were added per customer request. The controlled depth milling requirement to expose inner layer pads presented the primary manufacturing consideration.
DFM review verified the stackup for the tight 1.2 ± 0.12 mm tolerance. Controlled depth milling was set to approximately 0.78 ± 0.1 mm to precisely reveal L2 and L3 pads, followed by surface treatment on the exposed areas. Production and panelization files were confirmed after iterative updates. Stackup and milling parameters were adjusted to maintain structural integrity while achieving the required exposure without damaging adjacent layers. Controlled depth milling registration ensured accurate depth control and clean pad exposure across the batch.
All boards completed 100% flying probe testing successfully within the 27-day schedule. The final parts met dimensional, electrical, and visual specifications, with the depth-milled features providing the intended inner layer access while preserving overall board reliability.
Standard multilayer solution offering practical routing density and controlled impedance for industrial and consumer electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260520-046 | FR4 PCB | 2 | 94.21 x 275 | Green | ENIG (Immersion Gold) | 75 | View detail |
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |
| FR4-20260506-017 | FR4 PCB | 6 | 55 x 41.7 | Green | ENIG (Immersion Gold) | 15 | View detail |