PCB Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 10 pcs |
| Layers | 6 Layers | Board Type | Panel PCB |
| Dimensions | 110 x 90 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 5/5mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Matte Green | Silkscreen | White |
| Stack-up | Default | Impedance Control | No |
Manufacturing Timeline
Logistics Information
Key Manufacturing Processes
Manufacturing Summary
This production record covers ten 6-layer FR4 panel PCBs, each 110 x 90 mm with 1.6 mm thickness and 1 oz copper weight. The specification included 5/5 mil track and spacing as well as 0.2 mm minimum hole size, calling for detailed engineering review and precise inner layer imaging to ensure clean features without defects.
We performed circuit imaging and etching, followed by careful layer stack alignment and high pressure lamination to create robust multilayer boards. Matte green solder mask with white silkscreen was applied, and the boards received an immersion gold ENIG surface finish through electroless nickel deposition and gold immersion steps.
Completed over 11.3 days, the batch underwent thorough electrical testing that confirmed all connections. This process delivered reliable panels suited for the customer's application, maintaining quality throughout the tighter geometry elements of the design.
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Real Production Records
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260819-043 | FR4 PCB | 10 | 157 x 140 | Blue | ENIG (Immersion Gold) | 100 | View detail |
| FR4-20260818-014 | FR4 PCB | 2 | 110.32 x 173.3 | Green | ENIG (Immersion Gold) | 200 | View detail |
| FR4-20260811-033 | FR4 PCB | 8 | 226.8 x 109 | Green | ENIG (Immersion Gold) | 50 | View detail |
