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8 Layer FR4 PCB Production Record #FR4-20260430-009

FR4 PCB 8 Layers ENIG (Immersion Gold) Impedance Control 4/4mil Prototype
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PCB Specifications

Parameter Value Parameter Value
PCB Type FR4 PCB Quantity 20 pcs
Layers 8 Layers Board Type Single PCB
Dimensions 138.43 x 136.9 mm Copper Weight 1oz
Thickness 1.6 mm Min Track / Spacing 4/4mil
Surface Finish ENIG (Immersion Gold) Min Hole Size 0.2mm
Solder Mask Green Silkscreen White
Stack-up Custom Impedance Control No

Manufacturing Timeline

Order Created
Jan 01 00:00
Files Ready
Mar 30 10:35
Engineering Review Completed
Apr 17 09:22
Payment down
Jan 01 00:00
Production Started
Apr 17 09:22
Production Completed
Apr 27 15:45
Progress: 0/6
Engineering Review time: 18.0d Multiple File Revisions
Production time: 10.3d With Engineering Questions

Logistics Information

Production Completed→Shipping : 3.0d
Carrier
DHL
Destination
PHILIPPINES, THE
Shipping Method
Express Air
Shipping Time
Apr 30 15:17

Key Manufacturing Processes

01
Engineering Review
02
Material Preparation
03
Inner Layer Imaging
04
Circuit Imaging & Etching
05
Layer Stack Alignment
06
High Pressure Lamination
07
Solder Mask Application
08
Electroless Nickel Deposition
09
Immersion Gold Deposition
10
Electrical Testing

Manufacturing Summary

This 8-layer FR-4 board measured 138.43 × 136.9 mm with 1 oz copper on inner and outer layers and a finished thickness of 1.6 mm. Produced in a quantity of 20 pieces using Shengyi S1000-2M TG170 material, the design featured a 4 mil minimum line/space, ENIG surface finish, and resin plugging of selected vias. No blind vias or impedance control were required, with single-panel delivery and mechanical forming. The tighter geometry on an 8-layer stackup presented the primary manufacturing consideration.

 

DFM analysis addressed several file discrepancies prior to production. The customer-provided data showed hole-to-line clearance of only 4 mil in critical areas on the 8-layer PCB construction, below the preferred minimum for reliable yield. Multiple versions existed for GM/GM15 outlines, resin plug windowing, and press-fit hole indications, requiring clarification on the authoritative set. Resin plugging requirements were reconciled against actual drill data openings, and production files were jointly confirmed before release. resin plugging consistency handling ensured uniform fill and planarization across affected holes while maintaining registration within tolerance.

 

All panels completed 100% flying probe testing successfully with no additional issues. The final boards met dimensional and electrical specifications, supporting reliable downstream assembly and consistent performance for this medium-volume run.

 

Real Production Records

Order ID PCB Type Layers Dimensions Solder Mask Surface Finish Quantity Action
FR4-20260520-046 FR4 PCB 2 94.21 x 275 Green ENIG (Immersion Gold) 75 View detail
FR4-20260519-001 FR4 PCB 10 67.6 x 42 Green Gold Plating 20 View detail
FR4-20260515-068 FR4 PCB 14 244 x 267 Green ENIG (Immersion Gold) 10 View detail

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