| Parameter | Value | Parameter | Value |
|---|---|---|---|
| PCB Type | FR4 PCB | Quantity | 20 pcs |
| Layers | 8 Layers | Board Type | Single PCB |
| Dimensions | 138.43 x 136.9 mm | Copper Weight | 1oz |
| Thickness | 1.6 mm | Min Track / Spacing | 4/4mil |
| Surface Finish | ENIG (Immersion Gold) | Min Hole Size | 0.2mm |
| Solder Mask | Green | Silkscreen | White |
| Stack-up | Custom | Impedance Control | No |
This 8-layer FR-4 board measured 138.43 × 136.9 mm with 1 oz copper on inner and outer layers and a finished thickness of 1.6 mm. Produced in a quantity of 20 pieces using Shengyi S1000-2M TG170 material, the design featured a 4 mil minimum line/space, ENIG surface finish, and resin plugging of selected vias. No blind vias or impedance control were required, with single-panel delivery and mechanical forming. The tighter geometry on an 8-layer stackup presented the primary manufacturing consideration.
DFM analysis addressed several file discrepancies prior to production. The customer-provided data showed hole-to-line clearance of only 4 mil in critical areas on the 8-layer PCB construction, below the preferred minimum for reliable yield. Multiple versions existed for GM/GM15 outlines, resin plug windowing, and press-fit hole indications, requiring clarification on the authoritative set. Resin plugging requirements were reconciled against actual drill data openings, and production files were jointly confirmed before release. resin plugging consistency handling ensured uniform fill and planarization across affected holes while maintaining registration within tolerance.
All panels completed 100% flying probe testing successfully with no additional issues. The final boards met dimensional and electrical specifications, supporting reliable downstream assembly and consistent performance for this medium-volume run.
These boards integrate multiple microvia layers to support complex routing and high signal density in advanced electronics.
In-depth guide to the most frequent Engineering Queries (EQ) and DFM issues in Multilayer FR4 PCB (4/6/8+ layers) production. Real factory insights on stack-up confirmation, impedance control, copper balance, inner layer design, via treatment, registration, and practical prevention strategies.
| Order ID | PCB Type | Layers | Dimensions | Solder Mask | Surface Finish | Quantity | Action |
|---|---|---|---|---|---|---|---|
| FR4-20260520-046 | FR4 PCB | 2 | 94.21 x 275 | Green | ENIG (Immersion Gold) | 75 | View detail |
| FR4-20260519-001 | FR4 PCB | 10 | 67.6 x 42 | Green | Gold Plating | 20 | View detail |
| FR4-20260515-068 | FR4 PCB | 14 | 244 x 267 | Green | ENIG (Immersion Gold) | 10 | View detail |